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Dong W. Kim
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El Dorado Hills, CA, US
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last 30 patents
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Patent Grant
Microelectronic assembly having second level interconnects includin...
Patent number
7,750,466
Issue date
Jul 6, 2010
Intel Corporation
Timothy P. Rothman
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
Microelectronic Assembly Having Second Level Interconnects Includin...
Publication number
20090065943
Publication date
Mar 12, 2009
Timothy P. Rothman
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...