Dong Young PYEON

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Guri-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating carrier for wafer level package by using lead...
- Patent number 11,227,775
- Issue date Jan 18, 2022
- HAESUNGDS CO., LTD.
- Dong Young Pyeon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME
- Publication number 20230102887
- Publication date Mar 30, 2023
- HAESUNG DS CO., LTD.
- Dong Jin YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE, METHOD OF MANUFACTURING THE SAME,...
- Publication number 20230080101
- Publication date Mar 16, 2023
- HAESUNG DS CO., LTD.
- Dong Jin YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING CARRIER FOR WAFER LEVEL PACKAGE BY USING LEAD...
- Publication number 20210098268
- Publication date Apr 1, 2021
- HAESUNG DS CO., LTD
- Dong Young PYEON
- H01 - BASIC ELECTRIC ELEMENTS