Dong Zhong

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method to reduce power losses in an integrated voltag...
- Patent number 10,503,227
- Issue date Dec 10, 2019
- Intel Corporation
- Krishna Bharath
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus and method to reduce power losses in an integrated voltag...
- Patent number 9,753,510
- Issue date Sep 5, 2017
- Intel Corporation
- Krishna Bharath
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power plane to reduce voltage difference between connector power pins
- Patent number 7,492,605
- Issue date Feb 17, 2009
- Intel Corporation
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with trace configuration for high-speed digital diffe...
- Patent number 7,417,872
- Issue date Aug 26, 2008
- Intel Corporation
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex tape architecture for integrated circuit signal ingress/egress
- Patent number 7,321,167
- Issue date Jan 22, 2008
- Intel Corporation
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System to control effective series resistance of decoupling capacitor
- Patent number 7,286,368
- Issue date Oct 23, 2007
- Intel Corporation
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System to control effective series resistance of power delivery cir...
- Patent number 7,221,046
- Issue date May 22, 2007
- Intel Corporation
- Dong Zhong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor-related systems for addressing package/motherboard resonance
- Patent number 7,211,894
- Issue date May 1, 2007
- Intel Corporation
- Jennifer A. Hester
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor design for controlling equivalent series resistance
- Patent number 7,212,395
- Issue date May 1, 2007
- Intel Corporation
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon building blocks in integrated circuit packaging
- Patent number 7,205,638
- Issue date Apr 17, 2007
- Intel Corporation
- David Gregory Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low impedance inter-digital capacitor and method of using
- Patent number 7,173,803
- Issue date Feb 6, 2007
- Intel Corporation
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with trace configuration for high-speed digital diffe...
- Patent number 7,145,239
- Issue date Dec 5, 2006
- Intel Corporation
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low parasitic inductance capacitor with central terminals
- Patent number 7,136,272
- Issue date Nov 14, 2006
- Intel Corporation
- Yuan-Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with signal and power supply through vias
- Patent number 7,081,650
- Issue date Jul 25, 2006
- Intel Corporation
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon building block architecture with flex tape
- Patent number 6,995,465
- Issue date Feb 7, 2006
- Intel Corporation
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor-related systems for addressing package/motherboard resonance
- Patent number 6,992,387
- Issue date Jan 31, 2006
- Intel Corporation
- Jennifer A. Hester
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low impedance, high-power socket and method of using
- Patent number 6,964,584
- Issue date Nov 15, 2005
- Intel Corporation
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with trace configuration for high-speed digital diffe...
- Patent number 6,914,334
- Issue date Jul 5, 2005
- Intel Corporation
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power delivery through a flex tape in decoupled I/O-power hybrid su...
- Patent number 6,870,257
- Issue date Mar 22, 2005
- Intel Corporation
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon building blocks in integrated circuit packaging
- Patent number 6,815,256
- Issue date Nov 9, 2004
- Intel Corporation
- David Gregory Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly
- Patent number 6,803,649
- Issue date Oct 12, 2004
- Intel Corporation
- Jiangqi He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power/ground configuration for low impedance integrated circuit
- Patent number 6,784,532
- Issue date Aug 31, 2004
- Intel Corporation
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low impedance inter-digital capacitor and method of using
- Patent number 6,731,493
- Issue date May 4, 2004
- Intel Corporation
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD TO REDUCE POWER LOSSES IN AN INTEGRATED VOLTAG...
- Publication number 20180101207
- Publication date Apr 12, 2018
- Intel Corporation
- Krishna Bharath
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS AND METHOD TO REDUCE POWER LOSSES IN AN INTEGRATED VOLTAG...
- Publication number 20170060205
- Publication date Mar 2, 2017
- Intel Corporation
- Krishna Bharath
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Power plane to reduce voltage difference between connector power pins
- Publication number 20070295818
- Publication date Dec 27, 2007
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH TRACE CONFIGURATION FOR HIGH-SPEED DIGITAL DIFFE...
- Publication number 20060261465
- Publication date Nov 23, 2006
- Intel Corporation
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitor design for controlling equivalent series resistance
- Publication number 20060139847
- Publication date Jun 29, 2006
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System to control effective series resistance of decoupling capacitor
- Publication number 20060091564
- Publication date May 4, 2006
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System to control effective series resistance of power delivery cir...
- Publication number 20060087012
- Publication date Apr 27, 2006
- Dong Zhong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicon building block architecture with flex tape
- Publication number 20060006507
- Publication date Jan 12, 2006
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor-related systems for addressing package/motherboard resonance
- Publication number 20050194675
- Publication date Sep 8, 2005
- Jennifer A. Hester
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Circuit board with trace configuration for high-speed digital diffe...
- Publication number 20050139391
- Publication date Jun 30, 2005
- Intel Corporation
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicon building blocks in integrated circuit packaging
- Publication number 20050029555
- Publication date Feb 10, 2005
- David Gregory Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor-related systems for addressing package/motherboard resonance
- Publication number 20040257780
- Publication date Dec 23, 2004
- Jennifer A. Hester
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Power delivery through a flex tape in decoupled I/O-power hybrid su...
- Publication number 20040245014
- Publication date Dec 9, 2004
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon building block architecture with flex tape
- Publication number 20040245545
- Publication date Dec 9, 2004
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flex tape architecture for integrated circuit signal ingress/egress
- Publication number 20040245610
- Publication date Dec 9, 2004
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low impedance inter-digital capacitor and method of using
- Publication number 20040209518
- Publication date Oct 21, 2004
- Intel Corporation, Intel.
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer with signal and power supply through vias
- Publication number 20040188826
- Publication date Sep 30, 2004
- Cengiz A. Palanduz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low parasitic inductance capacitor with central terminals
- Publication number 20040190218
- Publication date Sep 30, 2004
- Intel Corporation
- Yuan-Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon building blocks in integrated circuit packaging
- Publication number 20040119144
- Publication date Jun 24, 2004
- Intel Corporation
- David Gregory Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via configuration for differential signaling through power or groun...
- Publication number 20040039859
- Publication date Feb 26, 2004
- Intel Corporation
- Jiangqi He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power/ground configuration for low impedance integrated circuit
- Publication number 20040021215
- Publication date Feb 5, 2004
- Intel Corporation
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board with trace configuration for high-speed digital diffe...
- Publication number 20030230807
- Publication date Dec 18, 2003
- Intel Corporation
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low impedance inter-digital capacitor and method of using
- Publication number 20030184951
- Publication date Oct 2, 2003
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangements to improve noise immunity of differential signals
- Publication number 20030133276
- Publication date Jul 17, 2003
- Dong Zhong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low impedance, high-power socket and method of using
- Publication number 20030119341
- Publication date Jun 26, 2003
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Apparatus and method to reduce power losses in an integrated voltag...

Apparatus and method to reduce power losses in an integrated voltag...

Power plane to reduce voltage difference between connector power pins

Circuit board with trace configuration for high-speed digital diffe...

Flex tape architecture for integrated circuit signal ingress/egress

System to control effective series resistance of decoupling capacitor

System to control effective series resistance of power delivery cir...

Capacitor-related systems for addressing package/motherboard resonance

Capacitor design for controlling equivalent series resistance

Silicon building blocks in integrated circuit packaging

Low impedance inter-digital capacitor and method of using

Circuit board with trace configuration for high-speed digital diffe...

Low parasitic inductance capacitor with central terminals

Interposer with signal and power supply through vias

Silicon building block architecture with flex tape

Capacitor-related systems for addressing package/motherboard resonance

Low impedance, high-power socket and method of using

Circuit board with trace configuration for high-speed digital diffe...

Power delivery through a flex tape in decoupled I/O-power hybrid su...

Silicon building blocks in integrated circuit packaging

Electronic assembly

Power/ground configuration for low impedance integrated circuit

Low impedance inter-digital capacitor and method of using

Patents Applicationslast 30 patents

APPARATUS AND METHOD TO REDUCE POWER LOSSES IN AN INTEGRATED VOLTAG...

APPARATUS AND METHOD TO REDUCE POWER LOSSES IN AN INTEGRATED VOLTAG...

Power plane to reduce voltage difference between connector power pins

CIRCUIT BOARD WITH TRACE CONFIGURATION FOR HIGH-SPEED DIGITAL DIFFE...

Capacitor design for controlling equivalent series resistance

System to control effective series resistance of decoupling capacitor

System to control effective series resistance of power delivery cir...

Silicon building block architecture with flex tape

Capacitor-related systems for addressing package/motherboard resonance

Circuit board with trace configuration for high-speed digital diffe...

Silicon building blocks in integrated circuit packaging

Capacitor-related systems for addressing package/motherboard resonance

Power delivery through a flex tape in decoupled I/O-power hybrid su...

Silicon building block architecture with flex tape

Flex tape architecture for integrated circuit signal ingress/egress

Low impedance inter-digital capacitor and method of using

Interposer with signal and power supply through vias

Low parasitic inductance capacitor with central terminals

Silicon building blocks in integrated circuit packaging

Via configuration for differential signaling through power or groun...

Power/ground configuration for low impedance integrated circuit

Circuit board with trace configuration for high-speed digital diffe...

Low impedance inter-digital capacitor and method of using

Arrangements to improve noise immunity of differential signals

Low impedance, high-power socket and method of using