Dongbing Shao

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Uniform chip gaps via injection-molded solder pillars
- Patent number 12,107,065
- Issue date Oct 1, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Color-map method to eliminate qubit frequency crowding in a quantum...
- Patent number 12,039,402
- Issue date Jul 16, 2024
- International Business Machines Corporation
- Jared Barney Hertzberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit wiring techniques for stacked transistor structures
- Patent number 11,894,303
- Issue date Feb 6, 2024
- International Business Machines Corporation
- Dongbing Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned double patterning with spacer-merge region
- Patent number 11,749,529
- Issue date Sep 5, 2023
- International Business Machines Corporation
- Rasit Onur Topaloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Addressing layout retargeting shortfalls
- Patent number 11,574,103
- Issue date Feb 7, 2023
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Highway jumper to enable long range connectivity for superconductin...
- Patent number 11,568,296
- Issue date Jan 31, 2023
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Coupled-line bus to suppress classical crosstalk for superconductin...
- Patent number 11,538,854
- Issue date Dec 27, 2022
- International Business Machines Corporation
- Firat Solgun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Qubit frequency tuning structures and fabrication methods for flip...
- Patent number 11,527,697
- Issue date Dec 13, 2022
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Self-aligned double patterning with spacer-merge region
- Patent number 11,302,532
- Issue date Apr 12, 2022
- International Business Machines Corporation
- Rasit Onur Topaloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump connection placement in quantum devices in a flip chip configu...
- Patent number 11,205,035
- Issue date Dec 21, 2021
- International Business Machines Corporation
- Dongbing Shao
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Hybrid readout package for quantum multichip bonding
- Patent number 11,195,799
- Issue date Dec 7, 2021
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Qubit frequency tuning structures and fabrication methods for flip...
- Patent number 11,195,982
- Issue date Dec 7, 2021
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tight pitch via structures enabled by orthogonal and non-orthogonal...
- Patent number 11,189,566
- Issue date Nov 30, 2021
- International Business Machines Corporation
- Dongbing Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor process modeling to enable skip via in place and rout...
- Patent number 11,163,932
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Air gap metal tip electrostatic discharge protection
- Patent number 11,165,248
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap metal tip electrostatic discharge protection
- Patent number 11,133,670
- Issue date Sep 28, 2021
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-color self-aligned double patterning (SADP) to yield static ran...
- Patent number 11,062,911
- Issue date Jul 13, 2021
- Tessera, Inc.
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebond cross-talk reduction for quantum computing chips
- Patent number 11,038,093
- Issue date Jun 15, 2021
- International Business Machines Corporation
- Dongbing Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor fabrication design rule loophole checking for design...
- Patent number 11,036,126
- Issue date Jun 15, 2021
- International Business Machines Corporation
- Chieh-Yu Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit wiring techniques for stacked transistor structures
- Patent number 10,950,545
- Issue date Mar 16, 2021
- International Business Machines Corporation
- Dongbing Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor process modeling to enable skip via in place and rout...
- Patent number 10,936,782
- Issue date Mar 2, 2021
- International Businesss Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Via design optimization to improve via resistance
- Patent number 10,915,690
- Issue date Feb 9, 2021
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Qubit frequency tuning structures and fabrication methods for flip...
- Patent number 10,903,412
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor process modeling to enable skip via in place and rout...
- Patent number 10,831,973
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Predicting local layout effects in circuit design patterns
- Patent number 10,831,976
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Jing Sha
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wirebond cross-talk reduction for quantum computing chips
- Patent number 10,833,238
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Horizontal-trench capacitor
- Patent number 10,833,146
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Zheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump connection placement in quantum devices in a flip chip configu...
- Patent number 10,796,069
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Perpendicular stacked field-effect transistor device
- Patent number 10,790,271
- Issue date Sep 29, 2020
- International Business Machines Corporation
- Zheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detecting hotspots in physical design layout patterns utilizing hot...
- Patent number 10,706,205
- Issue date Jul 7, 2020
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS
- Publication number 20240421113
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED DESIGN-TO-LITHOGRAPHY AND DESIGN CHECKING FOR STITCHED IN...
- Publication number 20240220697
- Publication date Jul 4, 2024
- International Business Machines Corporation
- DONGBING SHAO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SELF-ALIGNED DOUBLE PATTERNING WITH SPACER-MERGE REGION
- Publication number 20220181154
- Publication date Jun 9, 2022
- International Business Machines Corporation
- Rasit Onur Topaloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPOLE FILTER ON A QUANTUM DEVICE WITH MULTIPLEXING AND SIGNAL S...
- Publication number 20220058508
- Publication date Feb 24, 2022
- International Business Machines Corporation
- Srikanth Srinivasan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COLOR-MAP METHOD TO ELIMINATE QUBIT FREQUENCY CROWDING IN A QUANTUM...
- Publication number 20220058509
- Publication date Feb 24, 2022
- International Business Machines Corporation
- Jared Barney Hertzberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS
- Publication number 20220020715
- Publication date Jan 20, 2022
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP CONNECTION PLACEMENT IN QUANTUM DEVICES IN A FLIP CHIP CONFIGU...
- Publication number 20210397774
- Publication date Dec 23, 2021
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RAN...
- Publication number 20210343536
- Publication date Nov 4, 2021
- Tessera, Inc.
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID READOUT PACKAGE FOR QUANTUM MULTICHIP BONDING
- Publication number 20210305165
- Publication date Sep 30, 2021
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Coupled-Line Bus to Suppress Classical Crosstalk for Superconductin...
- Publication number 20210305315
- Publication date Sep 30, 2021
- International Business Machines Corporation
- Firat Solgun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED DOUBLE PATTERNING WITH SPACER-MERGE REGION
- Publication number 20210272806
- Publication date Sep 2, 2021
- International Business Machines Corporation
- Rasit Onur Topaloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDRESSING LAYOUT RETARGETING SHORTFALLS
- Publication number 20210240899
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGHWAY JUMPER TO ENABLE LONG RANGE CONNECTIVITY FOR SUPERCONDUCTIN...
- Publication number 20210183793
- Publication date Jun 17, 2021
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIREBOND CROSS-TALK REDUCTION FOR QUANTUM COMPUTING CHIPS
- Publication number 20210151656
- Publication date May 20, 2021
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT WIRING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES
- Publication number 20210111121
- Publication date Apr 15, 2021
- International Business Machines Corporation
- Dongbing Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUBIT FREQUENCY TUNING STRUCTURES AND FABRICATION METHODS FOR FLIP...
- Publication number 20210091295
- Publication date Mar 25, 2021
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PREDICTING LOCAL LAYOUT EFFECTS IN CIRCUIT DESIGN PATTERNS
- Publication number 20200380088
- Publication date Dec 3, 2020
- International Business Machines Corporation
- Jing Sha
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
QUBIT FREQUENCY TUNING STRUCTURES AND FABRICATION METHODS FOR FLIP...
- Publication number 20200335685
- Publication date Oct 22, 2020
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
QUBIT FREQUENCY TUNING STRUCTURES AND FABRICATION METHODS FOR FLIP...
- Publication number 20200335686
- Publication date Oct 22, 2020
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VIA DESIGN OPTIMIZATION TO IMPROVE VIA RESISTANCE
- Publication number 20200327208
- Publication date Oct 15, 2020
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Horizontal-Trench Capacitor
- Publication number 20200312951
- Publication date Oct 1, 2020
- International Business Machines Corporation
- Zheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT WIRING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES
- Publication number 20200286831
- Publication date Sep 10, 2020
- International Business Machines Corporation
- Dongbing Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RAN...
- Publication number 20200266072
- Publication date Aug 20, 2020
- Tessera, Inc.
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTING HOTSPOTS IN PHYSICAL DESIGN LAYOUT PATTERNS UTILIZING HOT...
- Publication number 20200125695
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPLICATION- OR ALGORITHM-SPECIFIC QUANTUM CIRCUIT DESIGN
- Publication number 20200089832
- Publication date Mar 19, 2020
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PROCESS MODELING TO ENABLE SKIP VIA IN PLACE AND ROU...
- Publication number 20200082049
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PROCESS MODELING TO ENABLE SKIP VIA IN PLACE AND ROU...
- Publication number 20200082047
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PROCESS MODELING TO ENABLE SKIP VIA IN PLACE AND ROU...
- Publication number 20200082048
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIREBOND CROSS-TALK REDUCTION FOR QUANTUM COMPUTING CHIPS
- Publication number 20200066961
- Publication date Feb 27, 2020
- International Business Machines Corporation
- DONGBING SHAO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
AIR GAP METAL TIP ELECTROSTATIC DISCHARGE PROTECTION
- Publication number 20200059090
- Publication date Feb 20, 2020
- International Business Machines Corporation
- Qianwen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Dongbing Shao

Person

Patents Grantslast 30 patents

Uniform chip gaps via injection-molded solder pillars

Color-map method to eliminate qubit frequency crowding in a quantum...

Circuit wiring techniques for stacked transistor structures

Self-aligned double patterning with spacer-merge region

Addressing layout retargeting shortfalls

Highway jumper to enable long range connectivity for superconductin...

Coupled-line bus to suppress classical crosstalk for superconductin...

Qubit frequency tuning structures and fabrication methods for flip...

Self-aligned double patterning with spacer-merge region

Bump connection placement in quantum devices in a flip chip configu...

Hybrid readout package for quantum multichip bonding

Qubit frequency tuning structures and fabrication methods for flip...

Tight pitch via structures enabled by orthogonal and non-orthogonal...

Semiconductor process modeling to enable skip via in place and rout...

Air gap metal tip electrostatic discharge protection

Air gap metal tip electrostatic discharge protection

Two-color self-aligned double patterning (SADP) to yield static ran...

Wirebond cross-talk reduction for quantum computing chips

Semiconductor fabrication design rule loophole checking for design...

Circuit wiring techniques for stacked transistor structures

Semiconductor process modeling to enable skip via in place and rout...

Via design optimization to improve via resistance

Qubit frequency tuning structures and fabrication methods for flip...

Semiconductor process modeling to enable skip via in place and rout...

Predicting local layout effects in circuit design patterns

Wirebond cross-talk reduction for quantum computing chips

Horizontal-trench capacitor

Bump connection placement in quantum devices in a flip chip configu...

Perpendicular stacked field-effect transistor device

Detecting hotspots in physical design layout patterns utilizing hot...

Patents Applicationslast 30 patents

UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS

AUTOMATED DESIGN-TO-LITHOGRAPHY AND DESIGN CHECKING FOR STITCHED IN...

SELF-ALIGNED DOUBLE PATTERNING WITH SPACER-MERGE REGION

MULTIPOLE FILTER ON A QUANTUM DEVICE WITH MULTIPLEXING AND SIGNAL S...

COLOR-MAP METHOD TO ELIMINATE QUBIT FREQUENCY CROWDING IN A QUANTUM...

UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS

BUMP CONNECTION PLACEMENT IN QUANTUM DEVICES IN A FLIP CHIP CONFIGU...

TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RAN...

HYBRID READOUT PACKAGE FOR QUANTUM MULTICHIP BONDING

Coupled-Line Bus to Suppress Classical Crosstalk for Superconductin...

SELF-ALIGNED DOUBLE PATTERNING WITH SPACER-MERGE REGION

ADDRESSING LAYOUT RETARGETING SHORTFALLS

HIGHWAY JUMPER TO ENABLE LONG RANGE CONNECTIVITY FOR SUPERCONDUCTIN...

WIREBOND CROSS-TALK REDUCTION FOR QUANTUM COMPUTING CHIPS

CIRCUIT WIRING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES

QUBIT FREQUENCY TUNING STRUCTURES AND FABRICATION METHODS FOR FLIP...

PREDICTING LOCAL LAYOUT EFFECTS IN CIRCUIT DESIGN PATTERNS

QUBIT FREQUENCY TUNING STRUCTURES AND FABRICATION METHODS FOR FLIP...

QUBIT FREQUENCY TUNING STRUCTURES AND FABRICATION METHODS FOR FLIP...

VIA DESIGN OPTIMIZATION TO IMPROVE VIA RESISTANCE

Horizontal-Trench Capacitor

CIRCUIT WIRING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES

TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RAN...

DETECTING HOTSPOTS IN PHYSICAL DESIGN LAYOUT PATTERNS UTILIZING HOT...

APPLICATION- OR ALGORITHM-SPECIFIC QUANTUM CIRCUIT DESIGN

SEMICONDUCTOR PROCESS MODELING TO ENABLE SKIP VIA IN PLACE AND ROU...

SEMICONDUCTOR PROCESS MODELING TO ENABLE SKIP VIA IN PLACE AND ROU...

SEMICONDUCTOR PROCESS MODELING TO ENABLE SKIP VIA IN PLACE AND ROU...

WIREBOND CROSS-TALK REDUCTION FOR QUANTUM COMPUTING CHIPS

AIR GAP METAL TIP ELECTROSTATIC DISCHARGE PROTECTION