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Dongchul KANG
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Chiyoda-ku, Tokyo, JP
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Patents Grants
last 30 patents
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Patent Grant
Sealing composition and semiconductor device
Patent number
11,854,919
Issue date
Dec 26, 2023
Resonac Corporation
Dongchul Kang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ENCAPSULATING MATERIAL FOR COMPRESSION MOLDING AND ELECTRONIC PART...
Publication number
20220315793
Publication date
Oct 6, 2022
Showa Denko Materials Co., Ltd.
Dongchul KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
Publication number
20210061986
Publication date
Mar 4, 2021
Hitachi Chemical Company, Ltd.
Dongchul KANG
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
SEALING COMPOSITION AND SEMICONDUCTOR DEVICE
Publication number
20200335409
Publication date
Oct 22, 2020
Hitachi ChemicalCompany, Ltd.
Dongchul KANG
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
Publication number
20200102454
Publication date
Apr 2, 2020
Hitachi Chemical Company, Ltd.
Dongchul KANG
H01 - BASIC ELECTRIC ELEMENTS