Donghyun BYUN

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Hinge assembly and electronic device including the same
- Patent number 12,066,872
- Issue date Aug 20, 2024
- Samsung Electronics Co., Ltd.
- Jongkeun Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Arm structure, hinge structure including the arm structure, and ele...
- Patent number 11,809,239
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Seunghyun Hwang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device with bonding structure
- Patent number 11,402,872
- Issue date Aug 2, 2022
- Samsung Electronics Co., Ltd.
- Daehyeong Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device with bonding structure
- Patent number 10,860,061
- Issue date Dec 8, 2020
- Samsung Electronics Co., Ltd.
- Daehyeong Park
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
ARM STRUCTURE, HINGE STRUCTURE INCLUDING THE ARM STRUCTURE, AND ELE...
- Publication number 20230205282
- Publication date Jun 29, 2023
- Samsung Electronics Co., Ltd.
- Seunghyun HWANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HINGE ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20230076291
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- Sukjin YUN
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
HINGE ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20220413562
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- Jongkeun KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ARM STRUCTURE, HINGE STRUCTURE INCLUDING THE ARM STRUCTURE, AND ELE...
- Publication number 20210373612
- Publication date Dec 2, 2021
- Samsung Electronics Co., Ltd.
- Seunghyun HWANG
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Application
ELECTRONIC DEVICE WITH BONDING STRUCTURE
- Publication number 20210089085
- Publication date Mar 25, 2021
- Samsung Electronics Co., Ltd.
- Daehyeong PARK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE WITH BONDING STRUCTURE
- Publication number 20200183455
- Publication date Jun 11, 2020
- Samsung Electronics Co., Ltd.
- Daehyeong PARK
- G06 - COMPUTING CALCULATING COUNTING

Donghyun BYUN

Person

Patents Grantslast 30 patents

Hinge assembly and electronic device including the same

Arm structure, hinge structure including the arm structure, and ele...

Electronic device with bonding structure

Electronic device with bonding structure

Patents Applicationslast 30 patents

ARM STRUCTURE, HINGE STRUCTURE INCLUDING THE ARM STRUCTURE, AND ELE...

HINGE ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME

HINGE ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME

ARM STRUCTURE, HINGE STRUCTURE INCLUDING THE ARM STRUCTURE, AND ELE...

ELECTRONIC DEVICE WITH BONDING STRUCTURE

ELECTRONIC DEVICE WITH BONDING STRUCTURE