DONGJIANG WANG

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Local interconnect structure and fabrication method
- Patent number 9,111,942
- Issue date Aug 18, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- Dongjiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and fabrication method thereof
- Patent number 9,111,874
- Issue date Aug 18, 2015
- Semiconductor Manufacturing International (Beijing) Corporation
- Dongjiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shallow trench and fabrication method
- Patent number 9,087,788
- Issue date Jul 21, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- Haiyang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-etch treating method
- Patent number 9,064,819
- Issue date Jun 23, 2015
- Semiconductor Manufacturing Internation (Beijing) Corporation
- Haiyang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS transistors, fin field-effect transistors and fabrication meth...
- Patent number 8,859,358
- Issue date Oct 14, 2014
- Semiconductor Manufacturing International Corp
- Dongjiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor devices
- Patent number 8,716,151
- Issue date May 6, 2014
- Semiconductor Manufacturing International (Beijing) Corporation
- Haiyang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 8,664,122
- Issue date Mar 4, 2014
- Semiconductor Manufacturing International (Beijing) Corporation
- Minda Hu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Post-etching treatment process for copper interconnecting wires
- Patent number 8,445,376
- Issue date May 21, 2013
- Semiconductor Manufacturing International Corp
- Dongjiang Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURES AND FABRICATION METHOD THEREOF
- Publication number 20150087150
- Publication date Mar 26, 2015
- Semiconductor Manufacturing International (Beijing) Corporation
- DONGJIANG WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHALLOW TRENCH AND FABRICATION METHOD
- Publication number 20140332932
- Publication date Nov 13, 2014
- Semiconductor Manufacturing International (Shanghai) Corporation
- HAIYANG ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL INTERCONNECT STRUCTURE AND FABRICATION METHOD
- Publication number 20140191404
- Publication date Jul 10, 2014
- Semiconductor Manufacturing International (Shanghai) Corporation
- DONGJIANG WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS TRANSISTORS, FIN FIELD-EFFECT TRANSISTORS AND FABRICATION METH...
- Publication number 20140191304
- Publication date Jul 10, 2014
- DONGJIANG WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICES
- Publication number 20130109175
- Publication date May 2, 2013
- Semiconductor Manufacturing International (Beijing) Corporation
- HAIYANG ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-ETCH TREATING METHOD
- Publication number 20130095657
- Publication date Apr 18, 2013
- Semiconductor Manufacturing International (Beijing) Corporation
- HAIYANG ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20130034960
- Publication date Feb 7, 2013
- Semiconductor Manufacturing International (Beijing) Corporation
- MINDA HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-ETCHING TREATMENT PROCESS FOR COPPER INTERCONNECTING WIRES
- Publication number 20120276737
- Publication date Nov 1, 2012
- Semiconductor Manufacturing International (Shanghai) Corporation
- DONGJIANG WANG
- H01 - BASIC ELECTRIC ELEMENTS

DONGJIANG WANG

Person

Patents Grantslast 30 patents

Local interconnect structure and fabrication method

Semiconductor structures and fabrication method thereof

Shallow trench and fabrication method

Post-etch treating method

CMOS transistors, fin field-effect transistors and fabrication meth...

Method of fabricating semiconductor devices

Method of fabricating a semiconductor device

Post-etching treatment process for copper interconnecting wires

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURES AND FABRICATION METHOD THEREOF

SHALLOW TRENCH AND FABRICATION METHOD

LOCAL INTERCONNECT STRUCTURE AND FABRICATION METHOD

CMOS TRANSISTORS, FIN FIELD-EFFECT TRANSISTORS AND FABRICATION METH...

METHOD OF FABRICATING SEMICONDUCTOR DEVICES

POST-ETCH TREATING METHOD

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE

POST-ETCHING TREATMENT PROCESS FOR COPPER INTERCONNECTING WIRES