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Dongjin Jung
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Icheon-si, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Integrated circuit packaging system having a cavity
Patent number
8,704,365
Issue date
Apr 22, 2014
Stats Chippac Ltd.
DongSam Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system with interposer
Patent number
8,035,210
Issue date
Oct 11, 2011
Stats Chippac Ltd.
Joungin Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system having a cavity
Patent number
7,989,950
Issue date
Aug 2, 2011
Stats Chippac Ltd.
DongSam Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package system with internal stacking module interposer
Patent number
7,901,987
Issue date
Mar 8, 2011
Stats Chippac Ltd.
Joungin Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with layered packaging and meth...
Patent number
7,863,100
Issue date
Jan 4, 2011
Stats Chippac Ltd.
Joungln Yang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING A CAVITY
Publication number
20110272807
Publication date
Nov 10, 2011
DongSam Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LAYERED PACKAGING AND METH...
Publication number
20100237482
Publication date
Sep 23, 2010
JoungIn Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING A CAVITY
Publication number
20100038781
Publication date
Feb 18, 2010
DongSam Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE-ON-PACKAGE SYSTEM WITH INTERNAL STACKING MODULE INTERPOSER
Publication number
20090236718
Publication date
Sep 24, 2009
Joungin Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERPOSER
Publication number
20090166835
Publication date
Jul 2, 2009
Joungin Yang
H01 - BASIC ELECTRIC ELEMENTS