Dongkwan KIM

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Hwaseong-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including plurality of semiconductor chips an...
- Patent number 11,935,868
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Kunsil Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PLURALITY OF SEMICONDUCTOR CHIPS AN...
- Publication number 20240186294
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Kunsil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230082912
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Wongi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SHEET AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230005872
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Dongkwan Kim
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PLURALITY OF SEMICONDUCTOR CHIPS AN...
- Publication number 20220223566
- Publication date Jul 14, 2022
- Samsung Electronics Co., Ltd.
- Kunsil LEE
- H01 - BASIC ELECTRIC ELEMENTS