Donglai David Lu

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Thermocompression bonding using plasma gas
- Patent number 10,297,567
- Issue date May 21, 2019
- Intel Corporation
- Donglai David Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package that includes fine powder coating
- Patent number 9,653,411
- Issue date May 16, 2017
- Intel Corporation
- Donglai David Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMOCOMPRESSION BONDING USING PLASMA GAS
- Publication number 20170179070
- Publication date Jun 22, 2017
- Donglai David Lu
- H01 - BASIC ELECTRIC ELEMENTS