Dongming He

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
C4 joint reliability
- Patent number 7,656,035
- Issue date Feb 2, 2010
- Intel Corporation
- Sairam Agraharam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die assembly having thermally conductive element at...
- Patent number 7,626,251
- Issue date Dec 1, 2009
- Intel Corporation
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
C4 joint reliability
- Patent number 7,517,787
- Issue date Apr 14, 2009
- Intel Corporation
- Sairam Agraharam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with reduced stress on die and associat...
- Patent number 7,465,651
- Issue date Dec 16, 2008
- Intel Corporation
- Sairam Agraharam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded on-die laser source and optical interconnect
- Patent number 7,251,389
- Issue date Jul 31, 2007
- Intel Corporation
- Daoqiang Lu
- G02 - OPTICS
Information Patent Grant
Integrated circuit packages with reduced stress on die and associat...
- Patent number 6,989,586
- Issue date Jan 24, 2006
- Intel Corporation
- Sairam Agraharam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
C4 JOINT RELIABILITY
- Publication number 20090115057
- Publication date May 7, 2009
- Sairam Agraharam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT AND METHOD OF FORMING THEREOF
- Publication number 20090065931
- Publication date Mar 12, 2009
- Intel Corporation
- Sudarshan V. Rangaraj
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Microelectronic die assembly having thermally conductive element at...
- Publication number 20080079125
- Publication date Apr 3, 2008
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded on-die laser source and optical interconnect
- Publication number 20070081760
- Publication date Apr 12, 2007
- Daoqiang Lu
- G02 - OPTICS
Information Patent Application
C4 joint reliability
- Publication number 20060214292
- Publication date Sep 28, 2006
- Sairam Agraharam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit packages with reduced stress on die and associat...
- Publication number 20050266613
- Publication date Dec 1, 2005
- Intel Corporation
- Sairam Agraharam
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated circuit package with reduced stress on die and associate...
- Publication number 20040188813
- Publication date Sep 30, 2004
- Intel Corporation
- Sairam Agraharam
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Dongming He

Person

Patents Grantslast 30 patents

C4 joint reliability

Microelectronic die assembly having thermally conductive element at...

C4 joint reliability

Integrated circuit packages with reduced stress on die and associat...

Embedded on-die laser source and optical interconnect

Integrated circuit packages with reduced stress on die and associat...

Patents Applicationslast 30 patents

C4 JOINT RELIABILITY

PACKAGED INTEGRATED CIRCUIT AND METHOD OF FORMING THEREOF

Microelectronic die assembly having thermally conductive element at...

Embedded on-die laser source and optical interconnect

C4 joint reliability

Integrated circuit packages with reduced stress on die and associat...

Integrated circuit package with reduced stress on die and associate...