Dongok KWAK

Follow

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Package substrate and semiconductor package including same
- Patent number 12,046,546
- Issue date Jul 23, 2024
- Samsung Electronics Co., Ltd.
- Shlege Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package and semiconductor package
- Patent number 11,791,321
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Tae-Young Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having stiffener
- Patent number 11,315,849
- Issue date Apr 26, 2022
- Samsung Electronics Co., Ltd.
- Suchang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package and semiconductor package
- Patent number 11,251,169
- Issue date Feb 15, 2022
- Samsung Electronics Co., Ltd.
- Tae-Young Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,437,518
- Issue date Sep 6, 2016
- Samsung Electronics Co., Ltd.
- Jaebum Byun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED SEMICONDUCTOR PACKAGE
- Publication number 20240079380
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Joonghyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING SAME
- Publication number 20230005831
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- SHLEGE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
- Publication number 20220157795
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- TAE-YOUNG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING STIFFENER
- Publication number 20210305117
- Publication date Sep 30, 2021
- Samsung Electronics Co., Ltd.
- Suchang LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
- Publication number 20200203325
- Publication date Jun 25, 2020
- Samsung Electronics Co., Ltd.
- TAE-YOUNG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20140117528
- Publication date May 1, 2014
- Samsung Electronics Co., Ltd.
- Jaebum BYUN
- H01 - BASIC ELECTRIC ELEMENTS