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DongSam Park
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Incheon, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Thermally enhanced FCBGA package
Patent number
12,107,028
Issue date
Oct 1, 2024
STATS ChipPAC Pte. Ltd.
KyungOe Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with compartmentalized lid for heat spreader and EMI shield
Patent number
11,823,973
Issue date
Nov 21, 2023
STATS ChipPAC Pte. Ltd.
DongSam Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally enhanced FCBGA package
Patent number
11,670,563
Issue date
Jun 6, 2023
STATS ChipPAC Pte. Ltd.
KyungOe Kim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Thermally Enhanced FCBGA Package
Publication number
20240421024
Publication date
Dec 19, 2024
STATS ChipPAC Pte Ltd.
KyungOe Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thermally Enhanced FCBGA Package
Publication number
20230260865
Publication date
Aug 17, 2023
STATS ChipPAC Pte Ltd.
KyungOe Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package with Compartmentalized Lid for Heat Spreader and EMI Shield
Publication number
20230119942
Publication date
Apr 20, 2023
STATS ChipPAC Pte Ltd.
DongSam Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thermally Enhanced FCBGA Package
Publication number
20220415744
Publication date
Dec 29, 2022
STATS ChipPAC Pte Ltd.
KyungOe Kim
H01 - BASIC ELECTRIC ELEMENTS