DongSam Park

Person

Seongnam-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of embedding TSV semiconductor die...
- Patent number 9,087,701
- Issue date Jul 21, 2015
- STATS ChipPAC, Ltd.
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with vertical interconnects and...
- Patent number 8,970,044
- Issue date Mar 3, 2015
- Stats Chippac Ltd.
- A Leam Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of embedding TSV semiconductor die...
- Patent number 8,883,561
- Issue date Nov 11, 2014
- STATS ChipPAC, Ltd.
- DongSam Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packaging system having a cavity
- Patent number 8,704,365
- Issue date Apr 22, 2014
- Stats Chippac Ltd.
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package system with through vias and method of manufactu...
- Patent number 8,598,034
- Issue date Dec 3, 2013
- Stats Chippac Ltd.
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with post and method of manufac...
- Patent number 8,460,968
- Issue date Jun 11, 2013
- Stats Chippac Ltd.
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package on package system
- Patent number 8,367,465
- Issue date Feb 5, 2013
- Stats Chippac Ltd.
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package system with through vias and method of manufactu...
- Patent number 8,334,601
- Issue date Dec 18, 2012
- Stats Chippac Ltd.
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with leadframe interposer and m...
- Patent number 8,110,905
- Issue date Feb 7, 2012
- Stats Chippac Ltd.
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with delamination prevention stru...
- Patent number 8,008,787
- Issue date Aug 30, 2011
- Stats Chippac Ltd.
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system having a cavity
- Patent number 7,989,950
- Issue date Aug 2, 2011
- Stats Chippac Ltd.
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package system with through vias and method of manufactu...
- Patent number 7,986,048
- Issue date Jul 26, 2011
- Stats Chippac Ltd.
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with layered packaging and meth...
- Patent number 7,863,100
- Issue date Jan 4, 2011
- Stats Chippac Ltd.
- Joungln Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package-in-package system
- Patent number 7,482,203
- Issue date Jan 27, 2009
- Stats Chippac Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package-in-package system
- Patent number 7,312,519
- Issue date Dec 25, 2007
- Stats Chippac Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package-in-package system with recessed...
- Patent number 7,298,037
- Issue date Nov 20, 2007
- Stats Chippac Ltd.
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Embedding TSV Semiconductor Die...
- Publication number 20150325553
- Publication date Nov 12, 2015
- STATS ChipPAC, Ltd.
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SYSTEM WITH THROUGH VIAS AND METHOD OF MANUFACTU...
- Publication number 20130075933
- Publication date Mar 28, 2013
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTS AND...
- Publication number 20120326325
- Publication date Dec 27, 2012
- A Leam Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Embedding TSV Semiconductor Die...
- Publication number 20120273959
- Publication date Nov 1, 2012
- STATS ChipPAC, Ltd.
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Embedding TSV Semiconductor Die...
- Publication number 20120273960
- Publication date Nov 1, 2012
- STATS ChipPAC, Ltd.
- DongSam Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POST AND METHOD OF MANUFAC...
- Publication number 20120068332
- Publication date Mar 22, 2012
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING A CAVITY
- Publication number 20110272807
- Publication date Nov 10, 2011
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SYSTEM WITH THROUGH VIAS AND METHOD OF MANUFACTU...
- Publication number 20110254172
- Publication date Oct 20, 2011
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LAYERED PACKAGING AND METH...
- Publication number 20100237482
- Publication date Sep 23, 2010
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SYSTEM WITH THROUGH VIAS AND METHOD OF MANUFACTU...
- Publication number 20100207262
- Publication date Aug 19, 2010
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING A CAVITY
- Publication number 20100038781
- Publication date Feb 18, 2010
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADFRAME INTERPOSER AND M...
- Publication number 20090152547
- Publication date Jun 18, 2009
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DELAMINATION PREVENTION STRU...
- Publication number 20090072377
- Publication date Mar 19, 2009
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked integrated circuit package-in-package system
- Publication number 20080105965
- Publication date May 8, 2008
- STATS ChipPAC Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ON PACKAGE SYSTEM
- Publication number 20070216006
- Publication date Sep 20, 2007
- STATS ChipPAC Ltd.
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked integrated circuit package-in-package system
- Publication number 20070158810
- Publication date Jul 12, 2007
- STATS ChipPAC Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS

DongSam Park

Person

Patents Grantslast 30 patents

Semiconductor device and method of embedding TSV semiconductor die...

Integrated circuit packaging system with vertical interconnects and...

Semiconductor device and method of embedding TSV semiconductor die...

Integrated circuit packaging system having a cavity

Package-on-package system with through vias and method of manufactu...

Integrated circuit packaging system with post and method of manufac...

Integrated circuit package on package system

Package-on-package system with through vias and method of manufactu...

Integrated circuit packaging system with leadframe interposer and m...

Integrated circuit package system with delamination prevention stru...

Integrated circuit packaging system having a cavity

Package-on-package system with through vias and method of manufactu...

Integrated circuit packaging system with layered packaging and meth...

Stacked integrated circuit package-in-package system

Stacked integrated circuit package-in-package system

Stacked integrated circuit package-in-package system with recessed...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Embedding TSV Semiconductor Die...

PACKAGE-ON-PACKAGE SYSTEM WITH THROUGH VIAS AND METHOD OF MANUFACTU...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTS AND...

Semiconductor Device and Method of Embedding TSV Semiconductor Die...

Semiconductor Device and Method of Embedding TSV Semiconductor Die...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POST AND METHOD OF MANUFAC...

INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING A CAVITY

PACKAGE-ON-PACKAGE SYSTEM WITH THROUGH VIAS AND METHOD OF MANUFACTU...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LAYERED PACKAGING AND METH...

PACKAGE-ON-PACKAGE SYSTEM WITH THROUGH VIAS AND METHOD OF MANUFACTU...

INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING A CAVITY

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADFRAME INTERPOSER AND M...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DELAMINATION PREVENTION STRU...

Stacked integrated circuit package-in-package system

INTEGRATED CIRCUIT PACKAGE ON PACKAGE SYSTEM

Stacked integrated circuit package-in-package system