Dongshun Bai

Person

Rolla, MO, US

People

Patents Grantslast 30 patents

Information Patent Grant
Polyimides as laser release materials for 3-D IC applications
- Patent number 9,827,740
- Issue date Nov 28, 2017
- Brewer Science Inc.
- Xiao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic olefin polymer compositions and polysiloxane release layers...
- Patent number 9,496,164
- Issue date Nov 15, 2016
- Brewer Science Inc.
- Dongshun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-leveling planarization materials for microelectronic topography
- Patent number 8,865,599
- Issue date Oct 21, 2014
- Brewer Science Inc.
- Dongshun Bai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Cyclic olefin compositions for temporary wafer bonding
- Patent number 8,771,442
- Issue date Jul 8, 2014
- Brewer Science Inc.
- Wenbin Hong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Cyclic olefin compositions for temporary wafer bonding
- Patent number 8,221,571
- Issue date Jul 17, 2012
- Brewer Science Inc.
- Wenbin Hong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Cyclic olefin compositions for temporary wafer bonding
- Patent number 8,092,628
- Issue date Jan 10, 2012
- Brewer Science Inc.
- Wenbin Hong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
CYCLIC OLEFIN POLYMER COMPOSITIONS AND POLYSILOXANE RELEASE LAYERS...
- Publication number 20170040200
- Publication date Feb 9, 2017
- BREWER SCIENCE INC.
- Dongshun Bai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLYIMIDES AS LASER RELEASE MATERIALS FOR 3-D IC APPLICATIONS
- Publication number 20160023436
- Publication date Jan 28, 2016
- BREWER SCIENCE INC.
- Xiao Liu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
CYCLIC OLEFIN POLYMER COMPOSITIONS AND POLYSILOXANE RELEASE LAYERS...
- Publication number 20150194331
- Publication date Jul 9, 2015
- BREWER SCIENCE INC.
- Dongshun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-LEVELING PLANARIZATION MATERIALS FOR MICROELECTRONIC TOPOGRAPHY
- Publication number 20130113086
- Publication date May 9, 2013
- BREWER SCIENCE INC.
- Dongshun Bai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CYCLIC OLEFIN COMPOSITIONS FOR TEMPORARY WAFER BONDING
- Publication number 20120291938
- Publication date Nov 22, 2012
- Brewer Science Inc.
- Wenbin Hong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CYCLIC OLEFIN COMPOSITIONS FOR TEMPORARY WAFER BONDING
- Publication number 20110086955
- Publication date Apr 14, 2011
- BREWER SCIENCE INC.
- Wenbin Hong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CYCLIC OLEFIN COMPOSITIONS FOR TEMPORARY WAFER BONDING
- Publication number 20100112305
- Publication date May 6, 2010
- Wenbin Hong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Dongshun Bai

Person

Patents Grantslast 30 patents

Polyimides as laser release materials for 3-D IC applications

Cyclic olefin polymer compositions and polysiloxane release layers...

Self-leveling planarization materials for microelectronic topography

Cyclic olefin compositions for temporary wafer bonding

Cyclic olefin compositions for temporary wafer bonding

Cyclic olefin compositions for temporary wafer bonding

Patents Applicationslast 30 patents

CYCLIC OLEFIN POLYMER COMPOSITIONS AND POLYSILOXANE RELEASE LAYERS...

POLYIMIDES AS LASER RELEASE MATERIALS FOR 3-D IC APPLICATIONS

CYCLIC OLEFIN POLYMER COMPOSITIONS AND POLYSILOXANE RELEASE LAYERS...

SELF-LEVELING PLANARIZATION MATERIALS FOR MICROELECTRONIC TOPOGRAPHY

CYCLIC OLEFIN COMPOSITIONS FOR TEMPORARY WAFER BONDING

CYCLIC OLEFIN COMPOSITIONS FOR TEMPORARY WAFER BONDING

CYCLIC OLEFIN COMPOSITIONS FOR TEMPORARY WAFER BONDING