DongSoo Moo

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Kyonggi-do, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming WLCSP structure using pr...
- Patent number 8,519,544
- Issue date Aug 27, 2013
- STATS Chip PAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming WLCSP structure using pr...
- Patent number 8,273,604
- Issue date Sep 25, 2012
- STAT ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming WLCSP Structure using Pr...
- Publication number 20120306097
- Publication date Dec 6, 2012
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming WLCSP Structure Using Pr...
- Publication number 20120211892
- Publication date Aug 23, 2012
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS