DONGUK KWON

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Asan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,288,745
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Donguk Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,272,652
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Jiwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package type semiconductor package including a lower sem...
- Patent number 11,749,592
- Issue date Sep 5, 2023
- Samsung Electronics Co., Ltd.
- Donguk Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,676,904
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Jiwon Shin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210533
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- JIWON SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR MAN...
- Publication number 20250174596
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Sunchul KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND METHOD OF MAN...
- Publication number 20250167015
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Donguk KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321823
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Donguk Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND A BONDING DEVICE FOR...
- Publication number 20240170448
- Publication date May 23, 2024
- Samsung Electronics Co.,Ltd.
- Sanghyeon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20240049400
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230387029
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- JIWON SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230132054
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Wooram MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230119406
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd
- Pilsung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230099351
- Publication date Mar 30, 2023
- Samsung Electronics Co., Ltd.
- Donguk KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20230091131
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PACKAGE INCLUDING A LOWER SEM...
- Publication number 20220122908
- Publication date Apr 21, 2022
- Samsung Electronics Co., Ltd.
- Donguk KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220045010
- Publication date Feb 10, 2022
- Samsung Electronics Co., Ltd.
- JIWON SHIN
- H01 - BASIC ELECTRIC ELEMENTS

DONGUK KWON

Person

Patents Grantslast 30 patents

Semiconductor package

Semiconductor package

Package-on-package type semiconductor package including a lower sem...

Semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR MAN...

APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND METHOD OF MAN...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND A BONDING DEVICE FOR...

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PACKAGE INCLUDING A LOWER SEM...

SEMICONDUCTOR PACKAGE