Dongwook KANG

Person

Bucheon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integration of semiconductor device assemblies with thermal dissipa...
- Patent number 11,961,782
- Issue date Apr 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer for power modules
- Patent number 11,145,571
- Issue date Oct 12, 2021
- Semiconductor Components Industries, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPA...
- Publication number 20240282663
- Publication date Aug 22, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUIDIC-CHANNEL COOLED SUBSTRATES
- Publication number 20240194564
- Publication date Jun 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jihwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES
- Publication number 20240186218
- Publication date Jun 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SUBSTRATES AND RELATED METHODS
- Publication number 20240120253
- Publication date Apr 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE
- Publication number 20240055334
- Publication date Feb 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE
- Publication number 20230327350
- Publication date Oct 12, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPA...
- Publication number 20210249332
- Publication date Aug 12, 2021
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT TRANSFER FOR POWER MODULES
- Publication number 20200388557
- Publication date Dec 10, 2020
- Semiconductor Components Industries, LLC
- Inpil YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Dongwook KANG

Person

Patents Grantslast 30 patents

Integration of semiconductor device assemblies with thermal dissipa...

Heat transfer for power modules

Patents Applicationslast 30 patents

INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPA...

FLUIDIC-CHANNEL COOLED SUBSTRATES

MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES

INTEGRATED SUBSTRATES AND RELATED METHODS

TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE

TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE

INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPA...

HEAT TRANSFER FOR POWER MODULES