Doowon KWON

Person

Seongnam-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Image sensor chip
- Patent number 11,776,982
- Issue date Oct 3, 2023
- Samsung Electronics Co., Ltd.
- Minho Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and manufacturing method of the same
- Patent number 11,652,130
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Doowon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 11,393,864
- Issue date Jul 19, 2022
- Samsung Electronics Co., Ltd.
- Ingyu Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 11,183,526
- Issue date Nov 23, 2021
- Samsung Electronics Co., Ltd.
- In Ho Ro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including a shield structure
- Patent number 10,930,685
- Issue date Feb 23, 2021
- Samsung Electronics Co., Ltd.
- Doowon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including stacked semiconductor chips
- Patent number 10,483,243
- Issue date Nov 19, 2019
- Samsung Electronics Co., Ltd.
- Donghyun Kim
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor devices including stacked semiconductor chips
- Patent number 10,199,355
- Issue date Feb 5, 2019
- Samsung Electronics Co., Ltd.
- Donghyun Kim
- F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
Information Patent Grant
Stack-type semiconductor device
- Patent number 9,859,321
- Issue date Jan 2, 2018
- Samsung Electronics Co., Ltd.
- Donghyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite wafer semiconductor devices using offset via arrangements...
- Patent number 9,780,136
- Issue date Oct 3, 2017
- Samsung Electronics Co., Ltd.
- Doowon Kwon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor
- Patent number 9,711,554
- Issue date Jul 18, 2017
- Samsung Electronics Co., Ltd.
- DooWon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating image sensors including impurity layer isola...
- Patent number 8,415,189
- Issue date Apr 9, 2013
- Samsung Electronics Co., Ltd.
- Doowon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors including impurity layer adjacent isolation region
- Patent number 7,586,170
- Issue date Sep 8, 2009
- Samsung Electronics Co., Ltd.
- Doowon Kwon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR
- Publication number 20250031476
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Minho JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20250031467
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Sooyoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BONDED SUBSTRATES AND MANUFACTURING...
- Publication number 20240363665
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Minho JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-LAYERED STACKED IMAGE SENSOR AND METHOD OF MANUFACTURING THE...
- Publication number 20240178259
- Publication date May 30, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Doowon KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR INCLUDING LANDING STRUCTURE HAVING SAME MATERIAL AS GA...
- Publication number 20240072091
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- MINHO JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY INTEGRATED IMAGE SENSORS USING INTER-SUBSTRATE WIRING STRUCT...
- Publication number 20240014243
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Minho Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20230282669
- Publication date Sep 7, 2023
- Samsung Electronics Co., Ltd.
- Doowon KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220392941
- Publication date Dec 8, 2022
- Samsung Electronics Co., Ltd.
- Doowon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR CHIP
- Publication number 20210351220
- Publication date Nov 11, 2021
- Samsung Electronics Co., Ltd.
- Minho Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE, MEMORY SYSTEM AND AUTONOMOUS DRIVING APPARATUS
- Publication number 20210134873
- Publication date May 6, 2021
- Samsung Electronics Co., Ltd.
- Doowon KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20210050379
- Publication date Feb 18, 2021
- Samsung Electronics Co., Ltd.
- Ingyu BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20200219912
- Publication date Jul 9, 2020
- Samsung Electronics Co., Ltd.
- IN HO RO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20200058688
- Publication date Feb 20, 2020
- Samsung Electronics Co., Ltd.
- Doowon KWON
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20190157245
- Publication date May 23, 2019
- Samsung Electronics Co., Ltd.
- Donghyun Kim
- B60 - VEHICLES IN GENERAL
Information Patent Application
Semiconductor Devices Including Stacked Semiconductor Chips
- Publication number 20170154873
- Publication date Jun 1, 2017
- Samsung Electronics Co., Ltd.
- Donghyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK-TYPE SEMICONDUCTOR DEVICE
- Publication number 20170125471
- Publication date May 4, 2017
- Samsung Electronics Co., Ltd.
- Donghyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE WAFER SEMICONDUCTOR DEVICES USING OFFSET VIA ARRANGEMENTS...
- Publication number 20170092680
- Publication date Mar 30, 2017
- Samsung Electronics Co., Ltd.
- Doowon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20160190198
- Publication date Jun 30, 2016
- Samsung Electronics Co., Ltd.
- DooWon KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING IMAGE SENSORS INCLUDING IMPURITY LAYER ISOLA...
- Publication number 20100015747
- Publication date Jan 21, 2010
- SAMSUNG ELECTRONICS CO., LTD.
- Doowon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSORS INCLUDING MULTIPLE SLOPE/IMPURITY LAYER ISOLATION REG...
- Publication number 20080035963
- Publication date Feb 14, 2008
- SAMSUNG ELECTRONICS CO., LTD.
- Doowon Kwon
- H01 - BASIC ELECTRIC ELEMENTS

Doowon KWON

Person

Patents Grantslast 30 patents

Image sensor chip

Image sensor and manufacturing method of the same

Image sensor

Image sensor

Image sensor including a shield structure

Semiconductor devices including stacked semiconductor chips

Semiconductor devices including stacked semiconductor chips

Stack-type semiconductor device

Composite wafer semiconductor devices using offset via arrangements...

Image sensor

Methods of fabricating image sensors including impurity layer isola...

Image sensors including impurity layer adjacent isolation region

Patents Applicationslast 30 patents

IMAGE SENSOR

IMAGE SENSOR

SEMICONDUCTOR DEVICE INCLUDING BONDED SUBSTRATES AND MANUFACTURING...

THREE-LAYERED STACKED IMAGE SENSOR AND METHOD OF MANUFACTURING THE...

IMAGE SENSOR INCLUDING LANDING STRUCTURE HAVING SAME MATERIAL AS GA...

HIGHLY INTEGRATED IMAGE SENSORS USING INTER-SUBSTRATE WIRING STRUCT...

IMAGE SENSOR

IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME

IMAGE SENSOR CHIP

MEMORY DEVICE, MEMORY SYSTEM AND AUTONOMOUS DRIVING APPARATUS

IMAGE SENSOR

IMAGE SENSOR

IMAGE SENSOR

SEMICONDUCTOR DEVICES INCLUDING STACKED SEMICONDUCTOR CHIPS

Semiconductor Devices Including Stacked Semiconductor Chips

STACK-TYPE SEMICONDUCTOR DEVICE

COMPOSITE WAFER SEMICONDUCTOR DEVICES USING OFFSET VIA ARRANGEMENTS...

IMAGE SENSOR

METHODS OF FABRICATING IMAGE SENSORS INCLUDING IMPURITY LAYER ISOLA...

IMAGE SENSORS INCLUDING MULTIPLE SLOPE/IMPURITY LAYER ISOLATION REG...