Dorreen Jane Ossenkop

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North Hudson, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Through substrate via including variable sidewall profile
- Patent number 7,863,180
- Issue date Jan 4, 2011
- International Business Machines Corporation
- Edward Crandal Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimal tungsten through wafer via and process of fabricating same
- Patent number 7,741,226
- Issue date Jun 22, 2010
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTIMAL TUNGSTEN THROUGH WAFER VIA AND PROCESS OF FABRICATING SAME
- Publication number 20090280643
- Publication date Nov 12, 2009
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA INCLUDING VARIABLE SIDEWALL PROFILE
- Publication number 20090278237
- Publication date Nov 12, 2009
- International Business Machines Corporation
- Edward Crandal Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS