Dosun Lee

Person

Gwangiu, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices having hybrid stacking structures and methods...
- Patent number 9,530,706
- Issue date Dec 27, 2016
- Samsung Electronics Co., Ltd.
- Pil-Kyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including stress relief structures
- Patent number 9,214,374
- Issue date Dec 15, 2015
- Samsung Electronics Co., Ltd.
- Dosun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through silicon via electrodes and...
- Patent number 9,153,559
- Issue date Oct 6, 2015
- Samsung Electronics Co., Ltd.
- Dosun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through electrodes
- Patent number 8,872,351
- Issue date Oct 28, 2014
- Samsung Electronics Co., Ltd.
- Kwangjin Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through electrodes and methods of fabr...
- Patent number 8,710,650
- Issue date Apr 29, 2014
- Samsung Electronics Co., Ltd.
- Sukchul Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chips and methods of forming the same
- Patent number 8,691,692
- Issue date Apr 8, 2014
- Samsung Electronics Co., Ltd.
- Dong-Chan Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through electrodes and methods of fabr...
- Patent number 8,551,860
- Issue date Oct 8, 2013
- Samsung Electronics Co., Ltd.
- Sukchul Bang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES HAVING HYBRID STACKING STRUCTURES AND METHODS...
- Publication number 20170110445
- Publication date Apr 20, 2017
- PIL-KYU KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING HYBRID STACKING STRUCTURES AND METHODS...
- Publication number 20150279825
- Publication date Oct 1, 2015
- Pil-Kyu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Having Through Electrodes and Methods of Fabr...
- Publication number 20140035144
- Publication date Feb 6, 2014
- Samsung Electronics Co., Ltd.
- Sukchul Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME
- Publication number 20130344695
- Publication date Dec 26, 2013
- Samsung Electronics Co., Ltd.
- Dong-Chan Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES AND METHODS FOR FAB...
- Publication number 20130200526
- Publication date Aug 8, 2013
- Samsung Electronics Co., Ltd.
- Kwangjin Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING THROUGH SILICON VIA ELECTRODES AND...
- Publication number 20130127019
- Publication date May 23, 2013
- SAMSUNG ELECTRONICS CO., LTD.
- Dosun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES AND METHODS OF FABR...
- Publication number 20130052794
- Publication date Feb 28, 2013
- SAMSUNG ELECTRONICS CO., LTD.
- Sukchul Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING STRESS RELIEF STRUCTURES
- Publication number 20120292746
- Publication date Nov 22, 2012
- SAMSUNG ELECTRONICS CO., LTD.
- Dosun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME
- Publication number 20120119376
- Publication date May 17, 2012
- Dong-Chan Lim
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor devices having hybrid stacking structures and methods...

Semiconductor devices including stress relief structures

Semiconductor devices including through silicon via electrodes and...

Semiconductor devices having through electrodes

Semiconductor devices having through electrodes and methods of fabr...

Semiconductor chips and methods of forming the same

Semiconductor devices having through electrodes and methods of fabr...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES HAVING HYBRID STACKING STRUCTURES AND METHODS...

SEMICONDUCTOR DEVICES HAVING HYBRID STACKING STRUCTURES AND METHODS...

Semiconductor Devices Having Through Electrodes and Methods of Fabr...

SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES AND METHODS FOR FAB...

SEMICONDUCTOR DEVICES INCLUDING THROUGH SILICON VIA ELECTRODES AND...

SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES AND METHODS OF FABR...

SEMICONDUCTOR DEVICES INCLUDING STRESS RELIEF STRUCTURES

SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME