Membership
Tour
Register
Log in
DoSung Chun
Follow
Person
Tempe, AZ, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Stackable semiconductor package having semiconductor chip within ce...
Patent number
7,061,120
Issue date
Jun 13, 2006
Amkor Technology, Inc.
WonSun Shin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Stackable semiconductor package having semiconductor chip within ce...
Publication number
20040175916
Publication date
Sep 9, 2004
Amkor Technology, Inc.
WonSun Shin
H01 - BASIC ELECTRIC ELEMENTS