Douglas B. Ingerly

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hyperchip
- Patent number 12,074,138
- Issue date Aug 27, 2024
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture hermetic guard ring for semiconductor on insulator devices
- Patent number 12,014,996
- Issue date Jun 18, 2024
- Intel Corporation
- Mohammad Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hyperchip
- Patent number 11,984,430
- Issue date May 14, 2024
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on active silicon semiconductor packages
- Patent number 11,978,727
- Issue date May 7, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with three-dimensional (3D) monolithic memo...
- Patent number 11,901,347
- Issue date Feb 13, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device structures and double-sided electrical te...
- Patent number 11,854,894
- Issue date Dec 26, 2023
- Intel Corporation
- Valluri R. Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device, system and method for providing inductor structures
- Patent number 11,830,829
- Issue date Nov 28, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hyperchip
- Patent number 11,824,041
- Issue date Nov 21, 2023
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid manufacturing for integrated circuit devices and assemblies
- Patent number 11,817,442
- Issue date Nov 14, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid manufacturing of microeletronic assemblies with first and se...
- Patent number 11,756,886
- Issue date Sep 12, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recoiled metal thin film for 3D inductor with tunable core
- Patent number 11,444,148
- Issue date Sep 13, 2022
- Intel Corporation
- Gwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device, system and method for providing inductor structures
- Patent number 11,387,198
- Issue date Jul 12, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors with back-side contacts to create three dimensional mem...
- Patent number 11,335,686
- Issue date May 17, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hyperchip
- Patent number 11,024,601
- Issue date Jun 1, 2021
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for improved through-silicon-vias
- Patent number 10,886,195
- Issue date Jan 5, 2021
- Intel Corporation
- Doug B. Ingerly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures
- Patent number 10,872,820
- Issue date Dec 22, 2020
- Intel Corporation
- Bruce Block
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse array for integrated circuit
- Patent number 10,811,354
- Issue date Oct 20, 2020
- Intel Corporation
- Gwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer interlayer dielectric and passivation materials for a micro...
- Patent number 8,154,121
- Issue date Apr 10, 2012
- Intel Corporation
- Kunal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treating surface of low-dielectric constant material to achieve goo...
- Patent number 6,930,033
- Issue date Aug 16, 2005
- Intel Corporation
- Douglas B. Ingerly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment of low-k dielectric material for CMP
- Patent number 6,717,265
- Issue date Apr 6, 2004
- Intel Corporation
- Douglas B. Ingerly
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYPERCHIP
- Publication number 20240243099
- Publication date Jul 18, 2024
- Intel Corporation
- Mark T. BOHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED ELECTRICAL TE...
- Publication number 20240194533
- Publication date Jun 13, 2024
- Intel Corporation
- Valluri R. RAO
- G01 - MEASURING TESTING
Information Patent Application
MOISTURE HERMETIC GUARD RING FOR SEMICONDUCTOR ON INSULATOR DEVICES
- Publication number 20240145410
- Publication date May 2, 2024
- Intel Corporation
- Mohammad Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYPERCHIP
- Publication number 20240038722
- Publication date Feb 1, 2024
- Intel Corporation
- Mark T. BOHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES
- Publication number 20240030213
- Publication date Jan 25, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYPERCHIP
- Publication number 20230238357
- Publication date Jul 27, 2023
- Intel Corporation
- Mark T. BOHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, SYSTEM AND METHOD FOR PROVIDING INDUCTOR STRUCTURES
- Publication number 20220302051
- Publication date Sep 22, 2022
- Intel Corporation
- Wilfred GOMES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES
- Publication number 20220181256
- Publication date Jun 9, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES
- Publication number 20220181313
- Publication date Jun 9, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES
- Publication number 20220173090
- Publication date Jun 2, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES WITH DIRECT CHIP ATTACH TO CIRCUIT BO...
- Publication number 20220173046
- Publication date Jun 2, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE HERMETIC GUARD RING FOR SEMICONDUCTOR ON INSULATOR DEVICES
- Publication number 20210407932
- Publication date Dec 30, 2021
- Intel Corporation
- Mohammad Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH THREE-DIMENSIONAL (3D) MONOLITHIC MEMO...
- Publication number 20210375849
- Publication date Dec 2, 2021
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYPERCHIP
- Publication number 20210225808
- Publication date Jul 22, 2021
- Intel Corporation
- Mark T. BOHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED ELECTRICAL TE...
- Publication number 20210175124
- Publication date Jun 10, 2021
- Intel Corporation
- Valluri R. RAO
- G01 - MEASURING TESTING
Information Patent Application
TRANSISTORS WITH BACK-SIDE CONTACTS TO CREATE THREE DIMENSIONAL MEM...
- Publication number 20210134802
- Publication date May 6, 2021
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON ACTIVE SILICON SEMICONDUCTOR PACKAGES
- Publication number 20210013188
- Publication date Jan 14, 2021
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, SYSTEM AND METHOD FOR PROVIDING INDUCTOR STRUCTURES
- Publication number 20200258852
- Publication date Aug 13, 2020
- Intel Corporation
- Wilfred GOMES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECOILED METAL THIN FILM FOR 3D INDUCTOR WITH TUNABLE CORE
- Publication number 20200194540
- Publication date Jun 18, 2020
- Gwang-Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYPERCHIP
- Publication number 20200066679
- Publication date Feb 27, 2020
- Intel Corporation
- Mark T. BOHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED FABRICATION T...
- Publication number 20200035560
- Publication date Jan 30, 2020
- Intel Corporation
- Bruce BLOCK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUSE ARRAY FOR INTEGRATED CIRCUIT
- Publication number 20190326216
- Publication date Oct 24, 2019
- Intel Corporation
- GWANG-SOO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR IMPROVED THROUGH-SILICON-VIAS
- Publication number 20190311973
- Publication date Oct 10, 2019
- Intel Corporation
- Doug B. Ingerly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER INTERLAYER DIELECTRIC AND PASSIVATION MATERIALS FOR A MICRO...
- Publication number 20090212421
- Publication date Aug 27, 2009
- Kunal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Treatment of low-k dielectric materials for CMP
- Publication number 20040132281
- Publication date Jul 8, 2004
- Douglas B. Ingerly
- H01 - BASIC ELECTRIC ELEMENTS

Douglas B. Ingerly

Person

Patents Grantslast 30 patents

Hyperchip

Moisture hermetic guard ring for semiconductor on insulator devices

Hyperchip

Package on active silicon semiconductor packages

Microelectronic package with three-dimensional (3D) monolithic memo...

Integrated circuit device structures and double-sided electrical te...

Device, system and method for providing inductor structures

Hyperchip

Hybrid manufacturing for integrated circuit devices and assemblies

Hybrid manufacturing of microeletronic assemblies with first and se...

Recoiled metal thin film for 3D inductor with tunable core

Device, system and method for providing inductor structures

Transistors with back-side contacts to create three dimensional mem...

Hyperchip

Systems and methods for improved through-silicon-vias

Integrated circuit structures

Fuse array for integrated circuit

Polymer interlayer dielectric and passivation materials for a micro...

Treating surface of low-dielectric constant material to achieve goo...

Treatment of low-k dielectric material for CMP

Patents Applicationslast 30 patents

HYPERCHIP

INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED ELECTRICAL TE...

MOISTURE HERMETIC GUARD RING FOR SEMICONDUCTOR ON INSULATOR DEVICES

HYPERCHIP

HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES

HYPERCHIP

DEVICE, SYSTEM AND METHOD FOR PROVIDING INDUCTOR STRUCTURES

HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES

HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES

INTEGRATED CIRCUIT ASSEMBLIES

INTEGRATED CIRCUIT ASSEMBLIES WITH DIRECT CHIP ATTACH TO CIRCUIT BO...

MOISTURE HERMETIC GUARD RING FOR SEMICONDUCTOR ON INSULATOR DEVICES

MICROELECTRONIC PACKAGE WITH THREE-DIMENSIONAL (3D) MONOLITHIC MEMO...

HYPERCHIP

INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED ELECTRICAL TE...

TRANSISTORS WITH BACK-SIDE CONTACTS TO CREATE THREE DIMENSIONAL MEM...

PACKAGE ON ACTIVE SILICON SEMICONDUCTOR PACKAGES

DEVICE, SYSTEM AND METHOD FOR PROVIDING INDUCTOR STRUCTURES

RECOILED METAL THIN FILM FOR 3D INDUCTOR WITH TUNABLE CORE

HYPERCHIP

INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED FABRICATION T...

FUSE ARRAY FOR INTEGRATED CIRCUIT

SYSTEMS AND METHODS FOR IMPROVED THROUGH-SILICON-VIAS

POLYMER INTERLAYER DIELECTRIC AND PASSIVATION MATERIALS FOR A MICRO...

Treatment of low-k dielectric materials for CMP