Douglas E. Chrzanowski

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Owego, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding method and apparatus
- Patent number 6,488,198
- Issue date Dec 3, 2002
- International Business Machines Corporation
- Douglas E. Chrzanowski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wire bonding method and apparatus
- Publication number 20010016462
- Publication date Aug 23, 2001
- International Business Machines Corporation
- Douglas E. Chrzanowski
- H01 - BASIC ELECTRIC ELEMENTS