Douglas E. Heckaman

Person

Indialantic, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect structure for interconnecting electronic modules
- Patent number 6,535,397
- Issue date Mar 18, 2003
- Harris Corporation
- William Clark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Phased array antenna having patch antenna elements with enhanced pa...
- Patent number 6,421,012
- Issue date Jul 16, 2002
- Harris Corporation
- Douglas E. Heckaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna horn and associated methods
- Patent number 6,271,799
- Issue date Aug 7, 2001
- Harris Corporation
- Gary A. Rief
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phased array antenna having stacked patch antenna element with sing...
- Patent number 6,266,015
- Issue date Jul 24, 2001
- Harris Corporation
- Douglas E. Heckaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi title-configured phased array antenna architecture
- Patent number 6,166,705
- Issue date Dec 26, 2000
- Harris Corporation
- Alan W. Mast
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cross-over distribution scheme for canceling mutually coupled signa...
- Patent number 6,130,585
- Issue date Oct 10, 2000
- Harris Corporation
- Walter M. Whybrew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributed ground pads for shielding cross-overs of mutually overl...
- Patent number 6,097,260
- Issue date Aug 1, 2000
- Harris Corporation
- Walter M. Whybrew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High isolation cross-over for canceling mutually coupled signals be...
- Patent number 6,028,494
- Issue date Feb 22, 2000
- Harris Corporation
- Jeffery C. May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat panel-configured electronically steerable phased array antenna...
- Patent number 5,835,062
- Issue date Nov 10, 1998
- Harris Corporation
- Douglas E. Heckaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact delay line formed of concentrically stacked, helically groo...
- Patent number 5,309,125
- Issue date May 3, 1994
- Harris Corporation
- Gilbert R. Perkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High isolation integrated switch circuit
- Patent number 5,272,457
- Issue date Dec 21, 1993
- Harris Corporation
- Douglas Heckaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed waffle-wall configured assembly including sidew...
- Patent number 5,218,373
- Issue date Jun 8, 1993
- Harris Corporation
- Douglas Heckaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waffleline-configured surface-mount package for high frequency sign...
- Patent number 5,124,677
- Issue date Jun 23, 1992
- Harris Corporation
- Douglas Heckaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a high speed, high density semiconductor memory pa...
- Patent number 5,122,475
- Issue date Jun 16, 1992
- Harris Corporation
- Douglas E. Heckaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave chip carrier package having cover-mounted antenna element
- Patent number 5,023,624
- Issue date Jun 11, 1991
- Harris Corporation
- Douglas E. Heckaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed, high density semiconductor memory package with chip lev...
- Patent number 5,014,114
- Issue date May 7, 1991
- Harris Corporation
- Douglas E. Heckaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-state, two-output variable RF power divider
- Patent number 4,956,621
- Issue date Sep 11, 1990
- Harris Corporation
- Douglas E. Heckaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance matched plug-in package for high speed microwave integrat...
- Patent number 4,951,011
- Issue date Aug 21, 1990
- Harris Corporation
- Douglas E. Heckaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replaceable MMIC chip carrier captured by differential thermal expa...
- Patent number 4,890,195
- Issue date Dec 26, 1989
- Harris Corporation
- Douglas E. Heckaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waffleline - configured transmission link
- Patent number 4,851,793
- Issue date Jul 25, 1989
- Harris Corporation
- Douglas E. Heckaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waffleline-configured microwave transmission link
- Patent number 4,695,810
- Issue date Sep 22, 1987
- Harris Corporation
- Douglas E. Heckaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniaturized microwave transmission link
- Patent number 4,641,140
- Issue date Feb 3, 1987
- Harris Corporation
- Douglas E. Heckaman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Interconnect structure for interconnecting electronic modules
- Publication number 20020180554
- Publication date Dec 5, 2002
- Harris Corporation
- William Clark
- G02 - OPTICS

Douglas E. Heckaman

Person

Patents Grantslast 30 patents

Interconnect structure for interconnecting electronic modules

Phased array antenna having patch antenna elements with enhanced pa...

Antenna horn and associated methods

Phased array antenna having stacked patch antenna element with sing...

Multi title-configured phased array antenna architecture

Cross-over distribution scheme for canceling mutually coupled signa...

Distributed ground pads for shielding cross-overs of mutually overl...

High isolation cross-over for canceling mutually coupled signals be...

Flat panel-configured electronically steerable phased array antenna...

Compact delay line formed of concentrically stacked, helically groo...

High isolation integrated switch circuit

Hermetically sealed waffle-wall configured assembly including sidew...

Waffleline-configured surface-mount package for high frequency sign...

Method of making a high speed, high density semiconductor memory pa...

Microwave chip carrier package having cover-mounted antenna element

High speed, high density semiconductor memory package with chip lev...

Three-state, two-output variable RF power divider

Impedance matched plug-in package for high speed microwave integrat...

Replaceable MMIC chip carrier captured by differential thermal expa...

Waffleline - configured transmission link

Waffleline-configured microwave transmission link

Miniaturized microwave transmission link

Patents Applicationslast 30 patents

Interconnect structure for interconnecting electronic modules