Douglas Patrick KELLEY

Person

Issaquah, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
3-D structured two-phase microfluidic cooling with nano structured...
- Patent number 12,189,441
- Issue date Jan 7, 2025
- Microsoft Technology Licensing, LLC
- Bharath Ramakrishnan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3-D structured two-phase cooling boilers with nano structured boili...
- Patent number 12,120,851
- Issue date Oct 15, 2024
- Microsoft Technology Licensing, LLC
- Dennis Trieu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High temperature superconductor-based interconnect systems with a l...
- Patent number 12,027,361
- Issue date Jul 2, 2024
- Microsoft Technology Licensing, LLC
- Dawson Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane interconnect system employing floating backplane intercon...
- Patent number 11,831,102
- Issue date Nov 28, 2023
- Microsoft Technology Licensing, LLC
- Douglas Patrick Kelley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer cooling
- Patent number 11,812,587
- Issue date Nov 7, 2023
- Microsoft Technology Licensing, LLC
- Douglas Patrick Kelley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive two-phase computer cooling
- Patent number 11,800,691
- Issue date Oct 24, 2023
- Microsoft Technology Licensing, LLC
- Kathryn Oseen-Senda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems with indium application to heat transfer surfaces
- Patent number 11,533,825
- Issue date Dec 20, 2022
- Microsoft Technology Licensing, LLC
- Douglas Patrick Kelley
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Conduction cooling for circuit boards
- Patent number 10,720,372
- Issue date Jul 21, 2020
- Microsoft Technology Licensing, LLC
- Douglas Patrick Kelley
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3-D STRUCTURED TWO-PHASE COOLING BOILERS WITH NANO STRUCTURED BOILI...
- Publication number 20240431075
- Publication date Dec 26, 2024
- Microsoft Technology Licensing, LLC
- Dennis TRIEU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3-D STRUCTURED TWO-PHASE COOLING BOILERS WITH NANO STRUCTURED BOILI...
- Publication number 20230345673
- Publication date Oct 26, 2023
- Microsoft Technology Licensing, LLC
- Dennis TRIEU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3-D STRUCTURED TWO-PHASE MICROFLUIDIC COOLING WITH NANO STRUCTURED...
- Publication number 20230341910
- Publication date Oct 26, 2023
- Microsoft Technology Licensing, LLC
- Bharath RAMAKRISHNAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR ADJUSTING PRESSURE IN IMMERSION-COOLED DATA...
- Publication number 20230301026
- Publication date Sep 21, 2023
- Microsoft Technology Licensing, LLC
- Douglas Patrick KELLEY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR TWO-PHASE COOLING OF ELECTRONIC COMPONENTS
- Publication number 20230189478
- Publication date Jun 15, 2023
- Microsoft Technology Licensing, LLC
- Douglas Patrick KELLEY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PASSIVE TWO-PHASE COMPUTER COOLING
- Publication number 20230189486
- Publication date Jun 15, 2023
- Microsoft Technology Licensing, LLC
- Kathryn OSEEN-SENDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR IMMERSION-COOLED COMPUTERS
- Publication number 20220408587
- Publication date Dec 22, 2022
- Microsoft Technology Licensing, LLC
- Douglas Patrick KELLEY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH TEMPERATURE SUPERCONDUCTOR-BASED INTERCONNECT SYSTEMS WITH A L...
- Publication number 20220375869
- Publication date Nov 24, 2022
- Microsoft Technology Licensing, LLC
- Dawson YEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Computer Cooling
- Publication number 20220354026
- Publication date Nov 3, 2022
- Microsoft Technology Licensing, LLC
- Douglas Patrick KELLEY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE INTERCONNECT SYSTEM EMPLOYING FLOATING BACKPLANE INTERCON...
- Publication number 20220247125
- Publication date Aug 4, 2022
- Microsoft Technology Licensing, LLC
- Douglas Patrick KELLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS WITH INDIUM APPLICATION TO HEAT TRANSFER SURFACES
- Publication number 20220183187
- Publication date Jun 9, 2022
- Microsoft Technology Licensing, LLC
- Douglas Patrick KELLEY
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CONDUCTION COOLING FOR CIRCUIT BOARDS
- Publication number 20200135608
- Publication date Apr 30, 2020
- Microsoft Technology Licensing, LLC
- Douglas Patrick KELLEY
- H01 - BASIC ELECTRIC ELEMENTS

Douglas Patrick KELLEY

Person

Patents Grantslast 30 patents

3-D structured two-phase microfluidic cooling with nano structured...

3-D structured two-phase cooling boilers with nano structured boili...

High temperature superconductor-based interconnect systems with a l...

Backplane interconnect system employing floating backplane intercon...

Computer cooling

Passive two-phase computer cooling

Systems with indium application to heat transfer surfaces

Conduction cooling for circuit boards

Patents Applicationslast 30 patents

3-D STRUCTURED TWO-PHASE COOLING BOILERS WITH NANO STRUCTURED BOILI...

3-D STRUCTURED TWO-PHASE COOLING BOILERS WITH NANO STRUCTURED BOILI...

3-D STRUCTURED TWO-PHASE MICROFLUIDIC COOLING WITH NANO STRUCTURED...

SYSTEMS AND METHODS FOR ADJUSTING PRESSURE IN IMMERSION-COOLED DATA...

SYSTEMS AND METHODS FOR TWO-PHASE COOLING OF ELECTRONIC COMPONENTS

PASSIVE TWO-PHASE COMPUTER COOLING

SYSTEMS AND METHODS FOR IMMERSION-COOLED COMPUTERS

HIGH TEMPERATURE SUPERCONDUCTOR-BASED INTERCONNECT SYSTEMS WITH A L...

Computer Cooling

BACKPLANE INTERCONNECT SYSTEM EMPLOYING FLOATING BACKPLANE INTERCON...

SYSTEMS WITH INDIUM APPLICATION TO HEAT TRANSFER SURFACES

CONDUCTION COOLING FOR CIRCUIT BOARDS