Douglas Scott

Follow

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electroplating using dielectric bridges
- Patent number 9,070,747
- Issue date Jun 30, 2015
- FlipChip International LLC
- Eugene A. Stout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film structure for high density inductors and redistribution i...
- Patent number 9,018,750
- Issue date Apr 28, 2015
- FlipChip International, LLC
- Robert Forcier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a final metal layer for wafer level packaging a...
- Patent number 8,980,743
- Issue date Mar 17, 2015
- FlipChip International LLC
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR APPLYING A FINAL METAL LAYER FOR WAFER LEVEL PACKAGING A...
- Publication number 20150270223
- Publication date Sep 24, 2015
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATING USING DIELECTRIC BRIDGES
- Publication number 20150001684
- Publication date Jan 1, 2015
- FlipChip International, LLC
- Eugene A. Stout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING A FINAL METAL LAYER FOR WAFER LEVEL PACKAGING A...
- Publication number 20130328203
- Publication date Dec 12, 2013
- FlipChip International, LLC
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM STRUCTURE FOR HIGH DENSITY INDUCTORS AND REDISTRIBUTION I...
- Publication number 20130037956
- Publication date Feb 14, 2013
- FlipChip International, LLC
- Robert Forcier
- H01 - BASIC ELECTRIC ELEMENTS