Douglas W. Hendricks

Person

Gulfstream, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Selective call receiver having a display module with integrated cir...
- Patent number 6,069,679
- Issue date May 30, 2000
- Motorola, Inc.
- Scott Joslin
- G02 - OPTICS
Information Patent Grant
Process for fabricating flex circuits and product thereby
- Patent number 5,800,723
- Issue date Sep 1, 1998
- Motorola, Inc.
- Frank J. Juskey
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for plating a substrate to eliminate the use of a solder mask
- Patent number 5,716,760
- Issue date Feb 10, 1998
- Motorola, Inc.
- Frank Juskey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing high density multi-layer integrated circuit ca...
- Patent number 5,679,498
- Issue date Oct 21, 1997
- Motorola, Inc.
- Jonathon G. Greenwood
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method and structure for attaching a circuit module to a circuit board
- Patent number 5,598,967
- Issue date Feb 4, 1997
- Motorola, Inc.
- Jonathon G. Greenwood
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for selectively applying solder paste to multiple types o...
- Patent number 5,452,656
- Issue date Sep 26, 1995
- Motorola, Inc.
- Christopher L. Becher
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Wire bond pad arrangement having improved pad density
- Patent number 5,444,303
- Issue date Aug 22, 1995
- Motorola, Inc.
- Jonathon Greenwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct chip attachment structure and method
- Patent number 5,439,162
- Issue date Aug 8, 1995
- Motorola, Inc.
- Reed A. George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for selectively applying solder paste to multi...
- Patent number 5,436,028
- Issue date Jul 25, 1995
- Motorola, Inc.
- Christopher L. Becher
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Anchoring method for flow formed integrated circuit covers
- Patent number 5,336,931
- Issue date Aug 9, 1994
- Motorola, Inc.
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for use in forming pre-positioned solder bumps...
- Patent number 5,323,947
- Issue date Jun 28, 1994
- Motorola, Inc.
- Frank Juskey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Subliming solder flux composition
- Patent number 5,296,046
- Issue date Mar 22, 1994
- Motorola, Inc.
- Frank J. Juskey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for applying solder flux
- Patent number 5,164,022
- Issue date Nov 17, 1992
- Motorola, Inc.
- Jerrold S. Pine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for photoimaging a three dimensional printed circuit substrate
- Patent number 5,001,038
- Issue date Mar 19, 1991
- Motorola, Inc.
- Dale W. Dorinski
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for effecting solder interconnects
- Patent number 4,889,275
- Issue date Dec 26, 1989
- Motorola, Inc.
- William B. Mullen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Douglas W. Hendricks

Person

Patents Grantslast 30 patents

Selective call receiver having a display module with integrated cir...

Process for fabricating flex circuits and product thereby

Method for plating a substrate to eliminate the use of a solder mask

Method for producing high density multi-layer integrated circuit ca...

Method and structure for attaching a circuit module to a circuit board

Apparatus for selectively applying solder paste to multiple types o...

Wire bond pad arrangement having improved pad density

Direct chip attachment structure and method

Method and apparatus for selectively applying solder paste to multi...

Anchoring method for flow formed integrated circuit covers

Method and apparatus for use in forming pre-positioned solder bumps...

Subliming solder flux composition

Method and apparatus for applying solder flux

Process for photoimaging a three dimensional printed circuit substrate

Method for effecting solder interconnects