Douglas W. Romm

Person

Sherman, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Palladium-spot leadframes for high adhesion semiconductor devices a...
- Patent number 7,939,378
- Issue date May 10, 2011
- Texas Instruments Incorporated
- Donald C. Abbott
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Palladium-spot leadframes for high adhesion semiconductor devices a...
- Patent number 7,245,006
- Issue date Jul 17, 2007
- Texas Instruments Incorporated
- Donald C. Abbott
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor leadframes plated with thick nickel, minimum palladiu...
- Patent number 7,064,008
- Issue date Jun 20, 2006
- Texas Instruments Incorporated
- Donald C. Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadframes for high adhesion semiconductor devices and method of fa...
- Patent number 6,953,986
- Issue date Oct 11, 2005
- Texas Instruments Incorporated
- Donald C. Abbott
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrical apparatus having resistance to atmospheric effects and m...
- Patent number 6,849,806
- Issue date Feb 1, 2005
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor leadframes plated with thick nickel, minimum palladiu...
- Patent number 6,713,852
- Issue date Mar 30, 2004
- Texas Instruments Incorporated
- Donald C. Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin tin preplated semiconductor leadframes
- Patent number 6,583,500
- Issue date Jun 24, 2003
- Texas Instruments Incorporated
- Donald C. Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite connection structure and method of manufacturing
- Patent number 6,337,445
- Issue date Jan 8, 2002
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Palladium-Spot Leadframes for High Adhesion Semiconductor Devices a...
- Publication number 20070243665
- Publication date Oct 18, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Donald C. Abbott
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Palladium-spot leadframes for high adhesion semiconductor devices a...
- Publication number 20060001132
- Publication date Jan 5, 2006
- Donald C. Abbott
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor leadframes plated with thick nickel, minimum palladiu...
- Publication number 20040183165
- Publication date Sep 23, 2004
- Donald C. Abbott
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor leadframes plated with thick nickel, minimum palladiu...
- Publication number 20030146497
- Publication date Aug 7, 2003
- Donald C. Abbott
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electrical apparatus having resistance to atmospheric effects and m...
- Publication number 20030094689
- Publication date May 22, 2003
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Palladium-spot leadframes for high adhesion semiconductor devices a...
- Publication number 20020070434
- Publication date Jun 13, 2002
- Donald C. Abbott
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Douglas W. Romm

Person

Patents Grantslast 30 patents

Palladium-spot leadframes for high adhesion semiconductor devices a...

Palladium-spot leadframes for high adhesion semiconductor devices a...

Semiconductor leadframes plated with thick nickel, minimum palladiu...

Leadframes for high adhesion semiconductor devices and method of fa...

Electrical apparatus having resistance to atmospheric effects and m...

Semiconductor leadframes plated with thick nickel, minimum palladiu...

Thin tin preplated semiconductor leadframes

Composite connection structure and method of manufacturing

Patents Applicationslast 30 patents

Palladium-Spot Leadframes for High Adhesion Semiconductor Devices a...

Palladium-spot leadframes for high adhesion semiconductor devices a...

Semiconductor leadframes plated with thick nickel, minimum palladiu...

Semiconductor leadframes plated with thick nickel, minimum palladiu...

Electrical apparatus having resistance to atmospheric effects and m...

Palladium-spot leadframes for high adhesion semiconductor devices a...