Douglas Walter Agnew

Person

Tigard, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal atomic layer deposition of silicon-containing films
- Patent number 12,157,945
- Issue date Dec 3, 2024
- Lam Research Corporation
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Oxidative conversion in atomic layer deposition processes
- Patent number 12,087,574
- Issue date Sep 10, 2024
- Lam Research Corporation
- Douglas Walter Agnew
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low-κ ALD gap-fill methods and material
- Patent number 12,020,923
- Issue date Jun 25, 2024
- Lam Research Corporation
- Joseph R. Abel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Minimization of carbon loss in ALD SiO2 deposition on hardmask films
- Patent number 10,692,717
- Issue date Jun 23, 2020
- Lam Research Corporation
- Douglas Walter Agnew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minimization of carbon loss in ALD SiO2 deposition on hardmask films
- Patent number 10,340,136
- Issue date Jul 2, 2019
- Lam Research Corporation
- Douglas Walter Agnew
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW-K ALD GAP-FILL METHODS AND MATERIAL
- Publication number 20240347337
- Publication date Oct 17, 2024
- LAM RESEARCH CORPORATION
- Joseph R. Abel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF SILICON-CONTAINING FILMS
- Publication number 20240327973
- Publication date Oct 3, 2024
- LAM RESEARCH CORPORATION
- Ravi KUMAR
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUSES FOR UNIFORM FLUID DELIVERY IN A MULTI-STATION SEMICONDU...
- Publication number 20240222151
- Publication date Jul 4, 2024
- LAM RESEARCH CORPORATION
- Eli Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU FILM ANNEALING IN SUBSTRATE PROCESSING
- Publication number 20240167153
- Publication date May 23, 2024
- LAM RESEARCH CORPORATION
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REDUCING INTRALEVEL CAPACITANCE IN SEMICONDUCTOR DEVICES
- Publication number 20230307290
- Publication date Sep 28, 2023
- LAM RESEARCH CORPORATION
- Joseph R. ABEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-FEATURE WET ETCH RATE RATIO REDUCTION
- Publication number 20230220544
- Publication date Jul 13, 2023
- LAM RESEARCH CORPORATION
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOSS PREVENTION DURING ATOMIC LAYER DEPOSITION
- Publication number 20230154754
- Publication date May 18, 2023
- LAM RESEARCH CORPORATION
- Jason Alexander VARNELL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRECURSORS FOR HIGH-TEMPERATURE DEPOSITION OF SILICON-CONTAINING FILMS
- Publication number 20230098270
- Publication date Mar 30, 2023
- LAM RESEARCH CORPORATION
- Douglas Walter Agnew
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
NON-PLASMA ENHANCED DEPOSITION FOR RECESS ETCH MATCHING
- Publication number 20230087976
- Publication date Mar 23, 2023
- LAM RESEARCH CORPORATION
- Ian John Curtin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU PECVD CAP LAYER
- Publication number 20230002887
- Publication date Jan 5, 2023
- LAM RESEARCH CORPORATION
- Jeremy David FIELDS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS TO ENABLE SEAMLESS HIGH QUALITY GAPFILL
- Publication number 20220384186
- Publication date Dec 1, 2022
- LAM RESEARCH CORPORATION
- Douglas Walter Agnew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ATOMIC LAYER DEPOSITION OF SILICON-CONTAINING FILMS
- Publication number 20220275510
- Publication date Sep 1, 2022
- LAM RESEARCH CORPORATION
- Awnish GUPTA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IN-SITU CONTROL OF FILM PROPERTIES DURING ATOMIC LAYER DEPOSITION
- Publication number 20220238325
- Publication date Jul 28, 2022
- LAM RESEARCH CORPORATION
- Douglas Walter Agnew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-K ALD GAP-FILL METHODS AND MATERIAL
- Publication number 20220037146
- Publication date Feb 3, 2022
- LAM RESEARCH CORPORATION
- Joseph R. Abel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD ANDD APPARATUS FOR ATOMIC LAYER DEPOSITION OR CHEMICAL VAPOR...
- Publication number 20210398780
- Publication date Dec 23, 2021
- LAM RESEARCH CORPORATION
- Adrien LAVOIE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MODIFYING HYDROPHOBICITY OF A WAFER SURFACE USING AN ORGANOSILICON...
- Publication number 20210384029
- Publication date Dec 9, 2021
- LAM RESEARCH CORPORATION
- Jeremy D. Fields
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDATIVE CONVERSION IN ATOMIC LAYER DEPOSITION PROCESSES
- Publication number 20210272801
- Publication date Sep 2, 2021
- LAM RESEARCH CORPORATION
- Douglas Walter Agnew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Minimization of Carbon Loss in ALD SiO2 Deposition on Hardmask Films
- Publication number 20200027718
- Publication date Jan 23, 2020
- LAM RESEARCH CORPORATION
- Douglas Walter Agnew
- H01 - BASIC ELECTRIC ELEMENTS

Douglas Walter Agnew

Person

Patents Grantslast 30 patents

Thermal atomic layer deposition of silicon-containing films

Oxidative conversion in atomic layer deposition processes

Low-κ ALD gap-fill methods and material

Minimization of carbon loss in ALD SiO2 deposition on hardmask films

Minimization of carbon loss in ALD SiO2 deposition on hardmask films

Patents Applicationslast 30 patents

LOW-K ALD GAP-FILL METHODS AND MATERIAL

PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF SILICON-CONTAINING FILMS

APPARATUSES FOR UNIFORM FLUID DELIVERY IN A MULTI-STATION SEMICONDU...

IN-SITU FILM ANNEALING IN SUBSTRATE PROCESSING

REDUCING INTRALEVEL CAPACITANCE IN SEMICONDUCTOR DEVICES

IN-FEATURE WET ETCH RATE RATIO REDUCTION

LOSS PREVENTION DURING ATOMIC LAYER DEPOSITION

PRECURSORS FOR HIGH-TEMPERATURE DEPOSITION OF SILICON-CONTAINING FILMS

NON-PLASMA ENHANCED DEPOSITION FOR RECESS ETCH MATCHING

IN-SITU PECVD CAP LAYER

METHODS TO ENABLE SEAMLESS HIGH QUALITY GAPFILL

THERMAL ATOMIC LAYER DEPOSITION OF SILICON-CONTAINING FILMS

IN-SITU CONTROL OF FILM PROPERTIES DURING ATOMIC LAYER DEPOSITION

LOW-K ALD GAP-FILL METHODS AND MATERIAL

METHOD ANDD APPARATUS FOR ATOMIC LAYER DEPOSITION OR CHEMICAL VAPOR...

MODIFYING HYDROPHOBICITY OF A WAFER SURFACE USING AN ORGANOSILICON...

OXIDATIVE CONVERSION IN ATOMIC LAYER DEPOSITION PROCESSES

Minimization of Carbon Loss in ALD SiO2 Deposition on Hardmask Films