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Douglas Ward Thomas
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Pacific Grove, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Methods of forming high aspect ratio plated through holes and high...
Patent number
11,399,439
Issue date
Jul 26, 2022
Sanmina Corporation
Douglas Ward Thomas
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer printed circuit board via hole registration and accuracy
Patent number
10,811,210
Issue date
Oct 20, 2020
Sanmina Corporation
Shinichi Iketani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer printed circuit board via hole registration and accuracy
Patent number
10,446,356
Issue date
Oct 15, 2019
Sanmina Corporation
Shinichi Iketani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods of forming high aspect ratio plated through holes and high...
Patent number
10,188,001
Issue date
Jan 22, 2019
Sanmina Corporation
Douglas Ward Thomas
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods of segmented through hole formation using dual diameter thr...
Patent number
9,661,758
Issue date
May 23, 2017
Sanmina Corporation
Douglas Ward Thomas
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
METHODS OF FORMING HIGH ASPECT RATIO PLATED THROUGH HOLES AND HIGH...
Publication number
20220338355
Publication date
Oct 20, 2022
Sanmina Corporation
Douglas Ward THOMAS
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTILAYER PRINTED CIRCUIT BOARD VIA HOLE REGISTRATION AND ACCURACY
Publication number
20200043690
Publication date
Feb 6, 2020
Sanmina Corporation
Shinichi Iketani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHODS OF FORMING HIGH ASPECT RATIO PLATED THROUGH HOLES AND HIGH...
Publication number
20190159346
Publication date
May 23, 2019
Sanmina Corporation
Douglas Ward THOMAS
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTILAYER PRINTED CIRCUIT BOARD VIA HOLE REGISTRATION AND ACCURACY
Publication number
20180110133
Publication date
Apr 19, 2018
Sanmina Corporation
Shinichi Iketani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHODS OF FORMING HIGH ASPECT RATIO PLATED THROUGH HOLES AND HIGH...
Publication number
20150208514
Publication date
Jul 23, 2015
Sanmina Corporation
Douglas Ward THOMAS
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHODS OF SEGMENTED THROUGH HOLE FORMATION USING DUAL DIAMETER THR...
Publication number
20150047188
Publication date
Feb 19, 2015
Sanmina Corporation
Douglas Ward Thomas
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
High aspect ratio plated through holes in a printed circuit board
Publication number
20060180346
Publication date
Aug 17, 2006
Suzanne Knight
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR