Dragan Podlesnik

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Arrangement for identifying uncontrolled events at the process modu...
- Patent number 8,983,631
- Issue date Mar 17, 2015
- Lam Research Corporation
- Chung Ho Huang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method of particle contaminant removal
- Patent number 8,828,145
- Issue date Sep 9, 2014
- Lam Research Corporation
- Yizhak Sabba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for surface treatment of semiconductor substra...
- Patent number 8,652,266
- Issue date Feb 18, 2014
- Lam Research Corporation
- Katrina Mikhaylichenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for particle removal by single-phase and two-phase media
- Patent number 8,226,775
- Issue date Jul 24, 2012
- Lam Research Corporation
- David S. L. Mui
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Materials for particle removal by single-phase and two-phase media
- Patent number 8,211,846
- Issue date Jul 3, 2012
- Lam Research Group
- David S. L. Mui
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Apparatus for particle removal by single-phase and two-phase media
- Patent number 8,084,406
- Issue date Dec 27, 2011
- Lam Research Corporation
- David S. L. Mui
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Method for etching high-aspect-ratio features
- Patent number 6,897,155
- Issue date May 24, 2005
- Applied Materials, Inc.
- Ajay Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of micromachining a multi-part cavity
- Patent number 6,827,869
- Issue date Dec 7, 2004
- Dragan Podlesnik
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methodologies to reduce process sensitivity to the chamber condition
- Patent number 6,808,647
- Issue date Oct 26, 2004
- Songlin Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for performing self cleaning method of forming deep trenc...
- Patent number 6,802,933
- Issue date Oct 12, 2004
- Anisul Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for in-situ etching a hardmask stack
- Patent number 6,696,365
- Issue date Feb 24, 2004
- Applied Materials, Inc.
- Ajay Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High resist-selectivity etch for silicon trench etch applications
- Patent number 6,653,237
- Issue date Nov 25, 2003
- Applied Materials, Inc.
- Shashank Deshmukh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dicing a semiconductor wafer
- Patent number 6,642,127
- Issue date Nov 4, 2003
- Applied Materials, Inc.
- Ajay Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for etching conductors at high etch rates
- Patent number 6,593,244
- Issue date Jul 15, 2003
- Applied Materials Inc.
- Yiqiong Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma etching of silicon using fluorinated gas mixtures
- Patent number 6,583,063
- Issue date Jun 24, 2003
- Applied Materials, Inc.
- Anisul Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two etchant etch method
- Patent number 6,518,192
- Issue date Feb 11, 2003
- Applied Materials Inc.
- Anisul Khan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High etch rate method for plasma etching silicon nitride
- Patent number 6,471,833
- Issue date Oct 29, 2002
- Applied Materials, Inc.
- Ajay Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two etchant etch method
- Patent number 6,391,788
- Issue date May 21, 2002
- Applied Materials, Inc.
- Anisul Khan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of etching organic ARCs in patterns having variable spacings
- Patent number 6,383,941
- Issue date May 7, 2002
- Applied Materials, Inc.
- Meihua Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon trench etch using silicon-containing precursors to reduce o...
- Patent number 6,380,095
- Issue date Apr 30, 2002
- Applied Materials, Inc.
- Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two etchant etch method
- Patent number 6,372,655
- Issue date Apr 16, 2002
- Applied Materials, Inc.
- Anisul Khan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Self cleaning method of forming deep trenches in silicon substrates
- Patent number 6,318,384
- Issue date Nov 20, 2001
- Applied Materials, Inc.
- Anisul Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling a profile of a structure formed on a substrate
- Patent number 6,303,513
- Issue date Oct 16, 2001
- Applied Materials, Inc.
- Anisul Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for plasma etching at a high etch rate
- Patent number 6,270,634
- Issue date Aug 7, 2001
- Applied Materials, Inc.
- Ajay Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching a trench having rounded top and bottom corners i...
- Patent number 6,235,643
- Issue date May 22, 2001
- Applied Materials, Inc.
- David Mui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching a trench having rounded top corners in a silicon...
- Patent number 6,180,533
- Issue date Jan 30, 2001
- Applied Materials, Inc.
- Alok Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for reducing circuit damage during PECVD in single wafer PE...
- Patent number 5,926,689
- Issue date Jul 20, 1999
- International Business Machines Corporation
- Donna Rizzone Cote
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for measuring plasma characteristics within a semiconduct...
- Patent number 5,801,386
- Issue date Sep 1, 1998
- Applied Materials, Inc.
- Valentin N. Todorov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching of silicon dioxide selectively to silicon nitride and polys...
- Patent number 5,505,816
- Issue date Apr 9, 1996
- International Business Machines Corporation
- Michael S. Barnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Neutral beam apparatus for in-situ production of reactants and kine...
- Patent number 5,468,955
- Issue date Nov 21, 1995
- International Business Machines Corporation
- Lee Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Systems for Surface Treatment of Semiconductor Substrates using Seq...
- Publication number 20140116476
- Publication date May 1, 2014
- LAM RESEARCH CORPORATION
- Katrina Mikhaylichenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PARTICLE REMOVAL BY SINGLE-PHASE AND TWO-PHASE MEDIA
- Publication number 20120132234
- Publication date May 31, 2012
- David S.L. Mui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT FOR IDENTIFYING UNCONTROLLED EVENTS AT THE PROCESS MODU...
- Publication number 20100332012
- Publication date Dec 30, 2010
- Chung-Ho Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of Particle Contaminant Removal
- Publication number 20100229890
- Publication date Sep 16, 2010
- Lam Research Corp.
- Yizhak T. Sabba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR SURFACE TREATMENT OF SEMICONDUCTOR SUBSTRA...
- Publication number 20100018553
- Publication date Jan 28, 2010
- LAM RESEARCH CORPORATION
- Katrina Mikhaylichenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PARTICLE REMOVAL BY SINGLE-PHASE AND TWO-PHASE MEDIA
- Publication number 20090151757
- Publication date Jun 18, 2009
- David S.L. Mui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PARTICLE REMOVAL BY SINGLE-PHASE AND TWO-PHASE MEDIA
- Publication number 20090151752
- Publication date Jun 18, 2009
- David S.L. Mui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIALS FOR PARTICLE REMOVAL BY SINGLE-PHASE AND TWO-PHASE MEDIA
- Publication number 20090156452
- Publication date Jun 18, 2009
- David S.L. Mui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etch chamber with dual frequency biasing sources and a single frequ...
- Publication number 20070020937
- Publication date Jan 25, 2007
- Jin-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etch chamber with dual frequency biasing sources and a single frequ...
- Publication number 20060175015
- Publication date Aug 10, 2006
- APPLIED MATERIALS, INC.
- Jin-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for etching high-aspect-ratio features
- Publication number 20040033697
- Publication date Feb 19, 2004
- APPLIED MATERIALS, INC.
- Ajay Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etch chamber with dual frequency biasing sources and a single frequ...
- Publication number 20040025791
- Publication date Feb 12, 2004
- APPLIED MATERIALS, INC.
- Jin-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Enhancing Critical Dimension Uniformity After Etch
- Publication number 20040018741
- Publication date Jan 29, 2004
- APPLIED MATERIALS, INC.
- Shashank C. Deshmukh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of reducing micromasking during plasma etching of a silicon-...
- Publication number 20030190814
- Publication date Oct 9, 2003
- Applied Materials, Inc.
- Ajay Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for in-situ etching a hardmask stack
- Publication number 20030129840
- Publication date Jul 10, 2003
- Ajay Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for dicing a semiconductor wafer
- Publication number 20030077878
- Publication date Apr 24, 2003
- APPLIED MATERIALS, INC.
- Ajay Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High resist-selectivity etch for silicon trench etch applications
- Publication number 20030003752
- Publication date Jan 2, 2003
- Shashank Deshmukh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of micromachining a multi-part cavity
- Publication number 20020185469
- Publication date Dec 12, 2002
- Applied Materials, Inc.
- Dragan Podlesnik
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Two etchant etch method
- Publication number 20020052113
- Publication date May 2, 2002
- APPLIED MATERIALS, INC.
- Anisul Khan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Two etchant etch method
- Publication number 20020016080
- Publication date Feb 7, 2002
- Anisul Khan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Self cleaning method of forming deep trenches in silicon substrates
- Publication number 20010051439
- Publication date Dec 13, 2001
- Applied Materials, Inc.
- Anisul Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for performing self cleaning method of forming deep trenc...
- Publication number 20010020516
- Publication date Sep 13, 2001
- Applied Materials, Inc.
- Anisul Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High etch rate method for plasma etching silicon nitride
- Publication number 20010019897
- Publication date Sep 6, 2001
- Applied Materials, Inc.
- Ajay Kumar
- H01 - BASIC ELECTRIC ELEMENTS

Dragan Podlesnik

Person

Patents Grantslast 30 patents

Arrangement for identifying uncontrolled events at the process modu...

Method of particle contaminant removal

Method and apparatus for surface treatment of semiconductor substra...

Methods for particle removal by single-phase and two-phase media

Materials for particle removal by single-phase and two-phase media

Apparatus for particle removal by single-phase and two-phase media

Method for etching high-aspect-ratio features

Method of micromachining a multi-part cavity

Methodologies to reduce process sensitivity to the chamber condition

Apparatus for performing self cleaning method of forming deep trenc...

Process for in-situ etching a hardmask stack

High resist-selectivity etch for silicon trench etch applications

Method for dicing a semiconductor wafer

Process for etching conductors at high etch rates

Plasma etching of silicon using fluorinated gas mixtures

Two etchant etch method

High etch rate method for plasma etching silicon nitride

Two etchant etch method

Method of etching organic ARCs in patterns having variable spacings

Silicon trench etch using silicon-containing precursors to reduce o...

Two etchant etch method

Self cleaning method of forming deep trenches in silicon substrates

Method for controlling a profile of a structure formed on a substrate

Method for plasma etching at a high etch rate

Method for etching a trench having rounded top and bottom corners i...

Method for etching a trench having rounded top corners in a silicon...

Process for reducing circuit damage during PECVD in single wafer PE...

Apparatus for measuring plasma characteristics within a semiconduct...

Etching of silicon dioxide selectively to silicon nitride and polys...

Neutral beam apparatus for in-situ production of reactants and kine...

Patents Applicationslast 30 patents

Systems for Surface Treatment of Semiconductor Substrates using Seq...

APPARATUS FOR PARTICLE REMOVAL BY SINGLE-PHASE AND TWO-PHASE MEDIA

ARRANGEMENT FOR IDENTIFYING UNCONTROLLED EVENTS AT THE PROCESS MODU...

Method of Particle Contaminant Removal

METHOD AND APPARATUS FOR SURFACE TREATMENT OF SEMICONDUCTOR SUBSTRA...

APPARATUS FOR PARTICLE REMOVAL BY SINGLE-PHASE AND TWO-PHASE MEDIA

METHODS FOR PARTICLE REMOVAL BY SINGLE-PHASE AND TWO-PHASE MEDIA

MATERIALS FOR PARTICLE REMOVAL BY SINGLE-PHASE AND TWO-PHASE MEDIA

Etch chamber with dual frequency biasing sources and a single frequ...

Etch chamber with dual frequency biasing sources and a single frequ...

Method for etching high-aspect-ratio features

Etch chamber with dual frequency biasing sources and a single frequ...

Method For Enhancing Critical Dimension Uniformity After Etch

Method of reducing micromasking during plasma etching of a silicon-...

Process for in-situ etching a hardmask stack

Method for dicing a semiconductor wafer

High resist-selectivity etch for silicon trench etch applications

Method of micromachining a multi-part cavity

Two etchant etch method

Two etchant etch method

Self cleaning method of forming deep trenches in silicon substrates

Apparatus for performing self cleaning method of forming deep trenc...

High etch rate method for plasma etching silicon nitride