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Duane D. Wendling
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Kutztown, PA, US
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last 30 patents
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Patent Grant
In-situ automated contactless thickness measurement for wafer thinning
Patent number
6,437,868
Issue date
Aug 20, 2002
Agere Systems Guardian Corp.
David Gerald Coult
B24 - GRINDING POLISHING
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Patent Grant
Fixture with at least one trough and method of using the fixture in...
Patent number
6,210,546
Issue date
Apr 3, 2001
Lucent Technologies Inc.
David G. Coult
C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES