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Duane Thomas Wilcoxen

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  • Dallas, TX, US
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Thinned semiconductor chip with edge support
    • Publication number 20210288014
    • Publication date Sep 16, 2021
    • DIODES INCORPORATED
    • Duane Wilcoxen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Chip Scale Package
    • Publication number 20170011979
    • Publication date Jan 12, 2017
    • DIODES INCORPORATED
    • Duane Thomas Wilcoxen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Chip Scale Package
    • Publication number 20160225733
    • Publication date Aug 4, 2016
    • DIODES INCORPORATION
    • Duane Thomas Wilcoxen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER LEVEL PACKAGING WITH HEAT DISSIPATION
    • Publication number 20110233756
    • Publication date Sep 29, 2011
    • MAXIM INTEGRATED PRODUCTS, INC.
    • VIREN KHANDEKAR
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    High-Electrical-Current Wafer Level Packaging, High-Electrical-Curr...
    • Publication number 20100072615
    • Publication date Mar 25, 2010
    • MAXIM INTEGRATED PRODUCTS, INC.
    • Arkadii V. Samoilov
    • H01 - BASIC ELECTRIC ELEMENTS