Duanliang CHENG

Person

Ningbo, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Camera module and molding circuit board assembly, circuit board and...
- Patent number 11,451,693
- Issue date Sep 20, 2022
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Array imaging module and molded photosensitive assembly, circuit bo...
- Patent number 11,163,216
- Issue date Nov 2, 2021
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Camera module and molding circuit board assembly, circuit board and...
- Patent number 11,039,052
- Issue date Jun 15, 2021
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit board, molded photosensitive assembly and manufacturing met...
- Patent number 11,032,454
- Issue date Jun 8, 2021
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- G02 - OPTICS
Information Patent Grant
Camera module, molding photosensitive assembly thereof, manufacturi...
- Patent number 10,979,610
- Issue date Apr 13, 2021
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Array imaging module and molded photosensitive assembly, circuit bo...
- Patent number 10,670,946
- Issue date Jun 2, 2020
- Mingzhu Wang
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Array imaging module and molded photosensitive assembly, circuit bo...
- Patent number 10,630,876
- Issue date Apr 21, 2020
- NingBo Sunny Opotech Co., Ltd.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Array imaging module and molded photosensitive assembly, circuit bo...
- Patent number 10,197,890
- Issue date Feb 5, 2019
- NingBo Sunny Opotech Co., Ltd.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Array imaging module and molded photosensitive assembly, circuit bo...
- Patent number 9,955,055
- Issue date Apr 24, 2018
- NingBo Sunny Opotech Co., Ltd.
- Mingzhu Wang
- G02 - OPTICS
Information Patent Grant
Manufacturing method of molded photosensitive assembly for electron...
- Patent number 9,894,772
- Issue date Feb 13, 2018
- NingBo Sunny Opotech Co., Ltd.
- Mingzhu Wang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Array imaging module and molded photosensitive assembly, circuit bo...
- Patent number 9,781,324
- Issue date Oct 3, 2017
- NingBo Sunny Opotech Co., Ltd.
- Mingzhu Wang
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
CAMERA MODULE AND MOLDING CIRCUIT BOARD ASSEMBLY, CIRCUIT BOARD AND...
- Publication number 20210266436
- Publication date Aug 26, 2021
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAMERA MODULE, MOLDING PHOTOSENSITIVE ASSEMBLY THEREOF, MANUFACTURI...
- Publication number 20210203818
- Publication date Jul 1, 2021
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Array Imaging Module and Molded Photosensitive Assembly, Circuit Bo...
- Publication number 20210055629
- Publication date Feb 25, 2021
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE AND MOLDING CIRCUIT BOARD ASSEMBLY, CIRCUIT BOARD AND...
- Publication number 20200244852
- Publication date Jul 30, 2020
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAMERA MODULE, MOLDING PHOTOSENSITIVE ASSEMBLY THEREOF, MANUFACTURI...
- Publication number 20200007726
- Publication date Jan 2, 2020
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Array Imaging Module and Molded Photosensitive Assembly, Circuit Bo...
- Publication number 20180113378
- Publication date Apr 26, 2018
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Array Imaging Module and Molded Photosensitive Assembly, Circuit Bo...
- Publication number 20170244874
- Publication date Aug 24, 2017
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- G02 - OPTICS
Information Patent Application
Array Imaging Module and Molded Photosensitive Assembly, Circuit Bo...
- Publication number 20170244877
- Publication date Aug 24, 2017
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- G02 - OPTICS
Information Patent Application
Array Imaging Module and Molded Photosensitive Assembly, Circuit Bo...
- Publication number 20170244878
- Publication date Aug 24, 2017
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- G02 - OPTICS
Information Patent Application
Array Imaging Module and Molded Photosensitive Assembly, Circuit Bo...
- Publication number 20170245370
- Publication date Aug 24, 2017
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- G02 - OPTICS

Duanliang CHENG

Person

Patents Grantslast 30 patents

Camera module and molding circuit board assembly, circuit board and...

Array imaging module and molded photosensitive assembly, circuit bo...

Camera module and molding circuit board assembly, circuit board and...

Circuit board, molded photosensitive assembly and manufacturing met...

Camera module, molding photosensitive assembly thereof, manufacturi...

Array imaging module and molded photosensitive assembly, circuit bo...

Array imaging module and molded photosensitive assembly, circuit bo...

Array imaging module and molded photosensitive assembly, circuit bo...

Array imaging module and molded photosensitive assembly, circuit bo...

Manufacturing method of molded photosensitive assembly for electron...

Array imaging module and molded photosensitive assembly, circuit bo...

Patents Applicationslast 30 patents

CAMERA MODULE AND MOLDING CIRCUIT BOARD ASSEMBLY, CIRCUIT BOARD AND...

CAMERA MODULE, MOLDING PHOTOSENSITIVE ASSEMBLY THEREOF, MANUFACTURI...

Array Imaging Module and Molded Photosensitive Assembly, Circuit Bo...

CAMERA MODULE AND MOLDING CIRCUIT BOARD ASSEMBLY, CIRCUIT BOARD AND...

CAMERA MODULE, MOLDING PHOTOSENSITIVE ASSEMBLY THEREOF, MANUFACTURI...

Array Imaging Module and Molded Photosensitive Assembly, Circuit Bo...

Array Imaging Module and Molded Photosensitive Assembly, Circuit Bo...

Array Imaging Module and Molded Photosensitive Assembly, Circuit Bo...

Array Imaging Module and Molded Photosensitive Assembly, Circuit Bo...

Array Imaging Module and Molded Photosensitive Assembly, Circuit Bo...