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Suwon-si, KR
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last 30 patents
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Patent Grant
Printed circuit board
Patent number
11,758,653
Issue date
Sep 12, 2023
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Sang Hoon Kim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board and substrate including electronic component...
Patent number
11,744,012
Issue date
Aug 29, 2023
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Dae Jung Byun
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing package substrate with fine circuit pattern...
Patent number
7,169,707
Issue date
Jan 30, 2007
Samsung Electro-Mechanics Co., Ltd.
Duck Young Maeng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
PRINTED CIRCUIT BOARD AND SUBSTRATE INCLUDING ELECTRONIC COMPONENT...
Publication number
20230354513
Publication date
Nov 2, 2023
Samsung Electro-Mechanics Co., Ltd.
Dae Jung BYUN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD
Publication number
20220174816
Publication date
Jun 2, 2022
Samsung Electro-Mechanics Co., Ltd.
Sang Hoon KIM
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD AND SUBSTRATE INCLUDING ELECTRONIC COMPONENT...
Publication number
20220078905
Publication date
Mar 10, 2022
Samsung Electro-Mechanics Co., Ltd.
Dae Jung BYUN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
Publication number
20140185254
Publication date
Jul 3, 2014
Samsung Electro-Mechanics Co., Ltd.
Jee Soo MOK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
Publication number
20140027167
Publication date
Jan 30, 2014
Min Sung Kim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD
Publication number
20120312775
Publication date
Dec 13, 2012
Samsung Electro-Mechanics Co., Ltd.
Je-Sik Yeon
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Printed circuit board and method for manufacturing the same
Publication number
20090194318
Publication date
Aug 6, 2009
Samsung Electro-Mechanics Co., Ltd.
Je-Sik Yeon
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of forming circuit pattern on printed circuit board
Publication number
20070132476
Publication date
Jun 14, 2007
Samsung Electro-Mechanics Co., Ltd.
Duck Young Maeng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of fabricating package substrate using electroless nickel pl...
Publication number
20060060558
Publication date
Mar 23, 2006
Samsung Electro-Mechanics Co., Ltd.
Duck Young Maeng
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method of manufacturing package substrate with fine circuit pattern...
Publication number
20060046485
Publication date
Mar 2, 2006
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Duck Young Maeng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of fabricating PCB in parallel manner
Publication number
20060029726
Publication date
Feb 9, 2006
Jee-Soo Mok
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR