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Dudi Amir
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Portland, OR, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method for improved high current component interconnections
Patent number
7,538,440
Issue date
May 26, 2009
Intel Corporation
Dudi I. Amir
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of creating solder bar connections on electronic packages
Patent number
7,185,799
Issue date
Mar 6, 2007
Intel Corporation
Tom E. Pearson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Selective area solder placement
Patent number
6,933,449
Issue date
Aug 23, 2005
Intel Corporation
Dudi Amir
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods for manufacturing printed circuit boards using a partial pr...
Patent number
6,840,169
Issue date
Jan 11, 2005
Intel Corporation
Dudi Amir
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Blocking cap for use in a partial printing process and apparatus
Patent number
6,823,783
Issue date
Nov 30, 2004
Intel Corporation
Dudi Amir
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic circuit board manufacturing process and associated appar...
Patent number
6,787,920
Issue date
Sep 7, 2004
Intel Corporation
Dudi Amir
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Partial printing process and apparatus
Patent number
6,626,099
Issue date
Sep 30, 2003
Intel Corporation
Dudi Amir
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board with solder-filled via
Patent number
6,555,761
Issue date
Apr 29, 2003
Intel Corporation
Dudi Amir
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Method for improved high current component interconnections
Publication number
20070125833
Publication date
Jun 7, 2007
Dudi I. Amir
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Method of mounting a substrate to a motherboard
Publication number
20060203459
Publication date
Sep 14, 2006
Thomas O. Morgan
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
RFID embedded in device
Publication number
20060109121
Publication date
May 25, 2006
Terry J. Dishongh
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Selective area solder placement
Publication number
20050235488
Publication date
Oct 27, 2005
Intel Corporation
Dudi Amir
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for improved high current component interconnections
Publication number
20050225953
Publication date
Oct 13, 2005
Dudi I. Amir
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Method of creating solder bar connections on electronic packages
Publication number
20050211750
Publication date
Sep 29, 2005
Tom E. Pearson
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Method for improved high current component interconnections
Publication number
20040216917
Publication date
Nov 4, 2004
Dudi I. Amir
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Methods for manufacturing printed circuit boards using a partial pr...
Publication number
20040050268
Publication date
Mar 18, 2004
Intel Corporation
Dudi Amir
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Blocking cap for use in a partial printing process and apparatus
Publication number
20040050266
Publication date
Mar 18, 2004
Intel Corporation
Dudi Amir
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Selective area solder placement
Publication number
20040007385
Publication date
Jan 15, 2004
Intel Corporation
Dudi Amir
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Electronic circuit board manufacturing process and associated appar...
Publication number
20030235044
Publication date
Dec 25, 2003
Dudi Amir
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Printed circuit board with solder-filled via
Publication number
20020084108
Publication date
Jul 4, 2002
Dudi Amir
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC