Dueng-Shiu Tzou

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Kaohsiung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Thin flip chip package structure
- Patent number 8,497,571
- Issue date Jul 30, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin flip chip package structure
- Patent number 8,471,372
- Issue date Jun 25, 2013
- Chipbound Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THIN FLIP CHIP PACKAGE STRUCTURE
- Publication number 20120080783
- Publication date Apr 5, 2012
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FLIP CHIP PACKAGE STRUCTURE
- Publication number 20120074545
- Publication date Mar 29, 2012
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS