Duk Ju Na

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming conductive vias by direc...
- Patent number 10,553,487
- Issue date Feb 4, 2020
- STATS ChipPAC Pte. Ltd.
- Xing Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming conductive vias by backs...
- Patent number 10,115,701
- Issue date Oct 30, 2018
- STATS ChipPAC Pte. Ltd.
- Xing Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming conductive vias using ba...
- Patent number 9,865,524
- Issue date Jan 9, 2018
- STATS ChipPAC Pte. Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming conductive vias by direc...
- Patent number 9,768,066
- Issue date Sep 19, 2017
- STATS ChipPAC Pte. Ltd.
- Xing Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of wafer thinning involving edge tr...
- Patent number 9,728,415
- Issue date Aug 8, 2017
- STATS ChipPAC Pte. Ltd.
- Vinoth Kanna Chockanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit through-substrate via system with a buffer layer...
- Patent number 9,281,274
- Issue date Mar 8, 2016
- Stats Chippac Ltd.
- Xing Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming guard ring around conduc...
- Patent number 9,257,382
- Issue date Feb 9, 2016
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming adhesive layer over insu...
- Patent number 9,184,104
- Issue date Nov 10, 2015
- STATS ChipPAC, Ltd.
- Lai Yee Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming through-silicon-via with...
- Patent number 9,076,655
- Issue date Jul 7, 2015
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming guard ring around conduc...
- Patent number 8,558,389
- Issue date Oct 15, 2013
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Conductive Vias by Direc...
- Publication number 20170365517
- Publication date Dec 21, 2017
- STATS ChipPAC Pte Ltd.
- Xing Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Vias by Direc...
- Publication number 20150380310
- Publication date Dec 31, 2015
- STATS ChipPAC, Ltd.
- Xing Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Vias by Backs...
- Publication number 20150380339
- Publication date Dec 31, 2015
- STATS ChipPAC, Ltd.
- Xing Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING ADHESIVE LAYER OVER INSU...
- Publication number 20150348861
- Publication date Dec 3, 2015
- STATS ChipPAC, Ltd.
- Lai Yee Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Wafer Thinning Involving Edge Tr...
- Publication number 20150179544
- Publication date Jun 25, 2015
- STATS ChipPAC, Ltd.
- Vinoth Kanna Chockanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Vias Using Ba...
- Publication number 20140300002
- Publication date Oct 9, 2014
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Through-Silicon-Via with...
- Publication number 20140199838
- Publication date Jul 17, 2014
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Guard Ring Around Conduc...
- Publication number 20130299998
- Publication date Nov 14, 2013
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Guard Ring Around Conduc...
- Publication number 20130147055
- Publication date Jun 13, 2013
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming conductive vias by direc...

Semiconductor device and method of forming conductive vias by backs...

Semiconductor device and method of forming conductive vias using ba...

Semiconductor device and method of forming conductive vias by direc...

Semiconductor device and method of wafer thinning involving edge tr...

Integrated circuit through-substrate via system with a buffer layer...

Semiconductor device and method of forming guard ring around conduc...

Semiconductor device and method of forming adhesive layer over insu...

Semiconductor device and method of forming through-silicon-via with...

Semiconductor device and method of forming guard ring around conduc...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Conductive Vias by Direc...

Semiconductor Device and Method of Forming Conductive Vias by Direc...

Semiconductor Device and Method of Forming Conductive Vias by Backs...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING ADHESIVE LAYER OVER INSU...

Semiconductor Device and Method of Wafer Thinning Involving Edge Tr...

Semiconductor Device and Method of Forming Conductive Vias Using Ba...

Semiconductor Device and Method of Forming Through-Silicon-Via with...

Semiconductor Device and Method of Forming Guard Ring Around Conduc...

Semiconductor Device and Method of Forming Guard Ring Around Conduc...