Duk Sang Han

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Daejeon, KR

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Patents Grantslast 30 patents

Information Patent Grant
Thermosetting resin composition having heat resistance and low diel...
- Patent number 9,957,389
- Issue date May 1, 2018
- Doosan Corporation
- Dong Hee Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THERMOSETTING RESIN COMPOSITION HAVING HEAT RESISTANCE AND LOW DIEL...
- Publication number 20160297967
- Publication date Oct 13, 2016
- Doosan Corporation
- Dong Hee JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND LAMINATE FOR PRINTED CIRCUIT BOARD COMPRISING...
- Publication number 20160150644
- Publication date May 26, 2016
- Doosan Corporation
- Hang Seok LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resine Composition For Printed Circuit Board And Composite Substrat...
- Publication number 20090004484
- Publication date Jan 1, 2009
- Doosan Corporation
- In Wook KIM
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resine Composition For Printed Circuit Board and Composite Substrat...
- Publication number 20090004488
- Publication date Jan 1, 2009
- Doosan Corporation
- Kwang Suk PARK
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...