Duksung Kim

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for die-to-die (D2D) interconnects
- Patent number 12,265,488
- Issue date Apr 1, 2025
- Samsung Electronics Co., Ltd.
- Wangyong Im
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250062303
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Joonho Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MEMORY MODULE AND OPTICAL COMPUTING SYSTEM INCLUDING THE SAME
- Publication number 20240427715
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- JOONHO JUN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347524
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Joonho Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR DIE-TO-DIE (D2D) INTERCONNECTS
- Publication number 20240241840
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Wangyong Im
- G06 - COMPUTING CALCULATING COUNTING