Dukyong LEE

Person

Cheon-an, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit direct cooling systems having substrates in cont...
- Patent number 11,967,540
- Issue date Apr 23, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer for power modules
- Patent number 11,610,832
- Issue date Mar 21, 2023
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a spacer with a junction cooling pipe
- Patent number 11,201,105
- Issue date Dec 14, 2021
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer for power modules
- Patent number 10,665,525
- Issue date May 26, 2020
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having junction cooling pipes embedded in sub...
- Patent number 10,607,919
- Issue date Mar 31, 2020
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20240234246
- Publication date Jul 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT TRANSFER FOR POWER MODULES
- Publication number 20230230895
- Publication date Jul 20, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20220093487
- Publication date Mar 24, 2022
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT TRANSFER FOR POWER MODULES
- Publication number 20200335414
- Publication date Oct 22, 2020
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20200185305
- Publication date Jun 11, 2020
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT TRANSFER FOR POWER MODULES
- Publication number 20190341327
- Publication date Nov 7, 2019
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20180315681
- Publication date Nov 1, 2018
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS

Dukyong LEE

Person

Patents Grantslast 30 patents

Integrated circuit direct cooling systems having substrates in cont...

Heat transfer for power modules

Semiconductor package having a spacer with a junction cooling pipe

Heat transfer for power modules

Semiconductor package having junction cooling pipes embedded in sub...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

HEAT TRANSFER FOR POWER MODULES

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

HEAT TRANSFER FOR POWER MODULES

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

HEAT TRANSFER FOR POWER MODULES

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS