Duncan Dobson

Person

Woodside, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cluster tool systems and methods for in fab wafer processing
- Patent number 6,852,012
- Issue date Feb 8, 2005
- Wafer Solutions, Inc.
- Krishna Vepa
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Substrate grinding systems and methods to reduce dot depth variation
- Publication number 20020090799
- Publication date Jul 11, 2002
- Krishna Vepa
- B24 - GRINDING POLISHING
Information Patent Application
Vacuum mount wafer polishing methods and apparatus
- Publication number 20020086625
- Publication date Jul 4, 2002
- Wafer Solutions, Inc.
- Krishna Vepa
- B24 - GRINDING POLISHING
Information Patent Application
Systems and methods to significantly reduce the grinding marks in s...
- Publication number 20020052169
- Publication date May 2, 2002
- Krishna Vepa
- B24 - GRINDING POLISHING
Information Patent Application
Free Floating double side polishing of substrates
- Publication number 20020052116
- Publication date May 2, 2002
- Krishna Vepa
- B24 - GRINDING POLISHING
Information Patent Application
Cluster tool systems and methods to eliminate wafer waviness during...
- Publication number 20020004358
- Publication date Jan 10, 2002
- Krishna Vepa
- B24 - GRINDING POLISHING
Information Patent Application
Grind polish cluster and methods to remove visual grind pattern
- Publication number 20020004265
- Publication date Jan 10, 2002
- Krishna Vepa
- B24 - GRINDING POLISHING
Information Patent Application
Cluster tool systems and methods for in fab wafer processing
- Publication number 20010027082
- Publication date Oct 4, 2001
- Krishna Vepa
- B24 - GRINDING POLISHING
Information Patent Application
Cluster tool systems and methods for processing wafers
- Publication number 20010024877
- Publication date Sep 27, 2001
- Krishna Vepa
- B24 - GRINDING POLISHING
Information Patent Application
Grind and single wafer etch process to remove metallic contaminatio...
- Publication number 20010023082
- Publication date Sep 20, 2001
- Krishna Vepa
- B24 - GRINDING POLISHING

Duncan Dobson

Person

Patents Grantslast 30 patents

Cluster tool systems and methods for in fab wafer processing

Patents Applicationslast 30 patents

Substrate grinding systems and methods to reduce dot depth variation

Vacuum mount wafer polishing methods and apparatus

Systems and methods to significantly reduce the grinding marks in s...

Free Floating double side polishing of substrates

Cluster tool systems and methods to eliminate wafer waviness during...

Grind polish cluster and methods to remove visual grind pattern

Cluster tool systems and methods for in fab wafer processing

Cluster tool systems and methods for processing wafers

Grind and single wafer etch process to remove metallic contaminatio...