DUO HUI BEI

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Patents Grantslast 30 patents

Information Patent Grant
Method for copper hillock reduction
- Patent number 8,815,615
- Issue date Aug 26, 2014
- Semiconductor Manufacturing International (Shanghai) Corp.
- Duo Hui Bei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR COPPER HILLOCK REDUCTION
- Publication number 20120070915
- Publication date Mar 22, 2012
- Semiconductor Manufacturing International (Shanghai) Corporation
- DUO HUI BEI
- H01 - BASIC ELECTRIC ELEMENTS