DUYEUL KIM

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having interconnection in package and method f...
- Patent number 11,837,273
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Jaehyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having interconnection in package and method f...
- Patent number 11,417,386
- Issue date Aug 16, 2022
- Samsung Electronics Co., Ltd.
- Jaehyung Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device having interconnection in package and method f...
- Patent number 11,328,760
- Issue date May 10, 2022
- Samsung Electronics Co., Ltd.
- Jaehyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having interconnection in package and method f...
- Patent number 10,971,208
- Issue date Apr 6, 2021
- Samsung Electronics Co., Ltd.
- Jaehyung Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device having interconnection in package and method f...
- Patent number 10,734,059
- Issue date Aug 4, 2020
- Samsung Electronics Co., Ltd.
- Jaehyung Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device having interconnection in package and method f...
- Patent number 10,418,087
- Issue date Sep 17, 2019
- Samsung Electronics Co., Ltd.
- Jaehyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having interconnection in package and method f...
- Patent number 9,805,769
- Issue date Oct 31, 2017
- Samsung Electronics Co., Ltd.
- Jaehyung Lee
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING INTERCONNECTION IN PACKAGE AND METHOD F...
- Publication number 20220358987
- Publication date Nov 10, 2022
- Samsung Electronics Co., Ltd.
- JAEHYUNG LEE
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE HAVING INTERCONNECTION IN PACKAGE AND METHOD F...
- Publication number 20210210132
- Publication date Jul 8, 2021
- Samsung Electronics Co., Ltd.
- JAEHYUNG LEE
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE HAVING INTERCONNECTION IN PACKAGE AND METHOD F...
- Publication number 20200143867
- Publication date May 7, 2020
- Samsung Electronics Co., Ltd.
- JAEHYUNG LEE
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE HAVING INTERCONNECTION IN PACKAGE AND METHOD F...
- Publication number 20200066323
- Publication date Feb 27, 2020
- Samsung Electronics Co., Ltd.
- JAEHYUNG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING INTERCONNECTION IN PACKAGE AND METHOD F...
- Publication number 20190355407
- Publication date Nov 21, 2019
- Samsung Electronics Co., Ltd.
- JAEHYUNG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING INTERCONNECTION IN PACKAGE AND METHOD F...
- Publication number 20170301388
- Publication date Oct 19, 2017
- Samsung Electronics Co., Ltd.
- JAEHYUNG LEE
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE HAVING INTERCONNECTION IN PACKAGE AND METHOD F...
- Publication number 20160012865
- Publication date Jan 14, 2016
- JAEHYUNG LEE
- G11 - INFORMATION STORAGE

Person

Patents Grantslast 30 patents

Semiconductor device having interconnection in package and method f...

Semiconductor device having interconnection in package and method f...

Semiconductor device having interconnection in package and method f...

Semiconductor device having interconnection in package and method f...

Semiconductor device having interconnection in package and method f...

Semiconductor device having interconnection in package and method f...

Semiconductor device having interconnection in package and method f...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING INTERCONNECTION IN PACKAGE AND METHOD F...

SEMICONDUCTOR DEVICE HAVING INTERCONNECTION IN PACKAGE AND METHOD F...

SEMICONDUCTOR DEVICE HAVING INTERCONNECTION IN PACKAGE AND METHOD F...

SEMICONDUCTOR DEVICE HAVING INTERCONNECTION IN PACKAGE AND METHOD F...

SEMICONDUCTOR DEVICE HAVING INTERCONNECTION IN PACKAGE AND METHOD F...

SEMICONDUCTOR DEVICE HAVING INTERCONNECTION IN PACKAGE AND METHOD F...

SEMICONDUCTOR DEVICE HAVING INTERCONNECTION IN PACKAGE AND METHOD F...