Dwayne Richard Shirley

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Dallas, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Lid for integrated circuit package
- Patent number 9,793,190
- Issue date Oct 17, 2017
- Texas Instruments Incorporated
- Dwayne Richard Shirley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive post protection for integrated circuit packages
- Patent number 9,768,108
- Issue date Sep 19, 2017
- QUALCOMM Incorporated
- Jie Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lidded integrated circuit package
- Patent number 9,190,341
- Issue date Nov 17, 2015
- Texas Instruments Incorporated
- Dwayne Richard Shirley
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE POST PROTECTION FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20160247754
- Publication date Aug 25, 2016
- QUALCOMM Incorporated
- Jie FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lid for Integrated Circuit Package
- Publication number 20150187677
- Publication date Jul 2, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Dwayne Richard Shirley
- B32 - LAYERED PRODUCTS
Information Patent Application
LIDDED INTEGRATED CIRCUIT PACKAGE
- Publication number 20130320517
- Publication date Dec 5, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Dwayne Richard Shirley
- B32 - LAYERED PRODUCTS