Dwight L. Daniels

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Patterned and planarized under-bump metallization
- Patent number 12,119,316
- Issue date Oct 15, 2024
- NXP USA, INC.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grounding lids in integrated circuit devices
- Patent number 11,127,645
- Issue date Sep 21, 2021
- NXP USA, INC.
- Dwight Lee Daniels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Media shield with EMI capability for pressure sensor
- Patent number 10,892,229
- Issue date Jan 12, 2021
- NXP USA, INC.
- Stephen Ryan Hooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio connection for EMI shielding
- Patent number 10,658,303
- Issue date May 19, 2020
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame having redistribution layer
- Patent number 10,381,295
- Issue date Aug 13, 2019
- NXP USA, INC.
- Michael Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for testing integrated circuit devices
- Patent number 9,818,656
- Issue date Nov 14, 2017
- NXP USA, INC.
- Mark Edward Schlarmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Environmental sensor structure
- Patent number 9,598,280
- Issue date Mar 21, 2017
- NXP USA, INC.
- Akhilesh K. Singh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package and method of manufacture
- Patent number 9,455,216
- Issue date Sep 27, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Dwight L. Daniels
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of bond pad protection during wafer processing
- Patent number 9,443,782
- Issue date Sep 13, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Robert F. Steimle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacture
- Patent number 9,093,436
- Issue date Jul 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Dwight L. Daniels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wettable lead ends on a flat-pack no-lead microelectronic package
- Patent number 9,070,669
- Issue date Jun 30, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Dwight L. Daniels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacture
- Patent number 8,841,758
- Issue date Sep 23, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Dwight L. Daniels
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods for fabricating sensor device package using a sealing struc...
- Patent number 8,476,087
- Issue date Jul 2, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor device with sealing structure
- Patent number 8,384,168
- Issue date Feb 26, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with a controlled cavity and method of formation
- Patent number 8,378,433
- Issue date Feb 19, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Scott M. Hayes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with a controlled cavity and method of formation
- Patent number 7,985,659
- Issue date Jul 26, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Scott M. Hayes
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
VIBRATION ISOLATION ASSEMBLIES FOR ELECTRONIC DEVICES
- Publication number 20250079335
- Publication date Mar 6, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKING WITH CONTROLLED ANGULAR ALIGNMENT
- Publication number 20240425367
- Publication date Dec 26, 2024
- NXP USA, Inc.
- Chayathorn Saklang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT
- Publication number 20240425364
- Publication date Dec 26, 2024
- NXP USA, Inc.
- Chayathorn Saklang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
A PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240379474
- Publication date Nov 14, 2024
- NXP USA, Inc.
- Ankur Shailesh Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION
- Publication number 20230378106
- Publication date Nov 23, 2023
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUNDING LIDS IN INTEGRATED CIRCUIT DEVICES
- Publication number 20200402878
- Publication date Dec 24, 2020
- NXP USA, Inc.
- Dwight Lee Daniels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEDIA SHIELD WITH EMI CAPABILITY FOR PRESSURE SENSOR
- Publication number 20200321286
- Publication date Oct 8, 2020
- NXP USA, Inc.
- Stephen Ryan Hooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO CONNECTION FOR EMI SHIELDING
- Publication number 20200152579
- Publication date May 14, 2020
- NXP USA, Inc.
- Michael B. VINCENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME HAVING REDISTRIBUTION LAYER
- Publication number 20190080991
- Publication date Mar 14, 2019
- NXP USA, Inc.
- Michael VINCENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENVIRONMENTAL SENSOR STRUCTURE
- Publication number 20160130136
- Publication date May 12, 2016
- Freescale Semiconductor, Inc.
- AKHILESH K. SINGH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20150228560
- Publication date Aug 13, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Dwight L. DANIELS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20140338956
- Publication date Nov 20, 2014
- Dwight L. DANIELS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WETTABLE LEAD ENDS ON A FLAT-PACK NO-LEAD MICROELECTRONIC PACKAGE
- Publication number 20140134799
- Publication date May 15, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Dwight L. DANIELS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20140001616
- Publication date Jan 2, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Dwight L. DANIELS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING SENSOR DEVICE PACKAGE USING A SEALING STRUC...
- Publication number 20120270354
- Publication date Oct 25, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE WITH SEALING STRUCTURE
- Publication number 20120266684
- Publication date Oct 25, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH A CONTROLLED CAVITY AND METHOD OF FORMATION
- Publication number 20110241181
- Publication date Oct 6, 2011
- FREESCALE SEMICONDUCTOR, INC.
- SCOTT M. HAYES
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Dwight L. Daniels

Person

Patents Grantslast 30 patents

Patterned and planarized under-bump metallization

Grounding lids in integrated circuit devices

Media shield with EMI capability for pressure sensor

High aspect ratio connection for EMI shielding

Lead frame having redistribution layer

Devices and methods for testing integrated circuit devices

Environmental sensor structure

Semiconductor device package and method of manufacture

Method of bond pad protection during wafer processing

Semiconductor device package and method of manufacture

Wettable lead ends on a flat-pack no-lead microelectronic package

Semiconductor device package and method of manufacture

Methods for fabricating sensor device package using a sealing struc...

Sensor device with sealing structure

Semiconductor device with a controlled cavity and method of formation

Semiconductor device with a controlled cavity and method of formation

Patents Applicationslast 30 patents

VIBRATION ISOLATION ASSEMBLIES FOR ELECTRONIC DEVICES

DIE STACKING WITH CONTROLLED ANGULAR ALIGNMENT

DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT

A PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION

GROUNDING LIDS IN INTEGRATED CIRCUIT DEVICES

MEDIA SHIELD WITH EMI CAPABILITY FOR PRESSURE SENSOR

HIGH ASPECT RATIO CONNECTION FOR EMI SHIELDING

LEAD FRAME HAVING REDISTRIBUTION LAYER

ENVIRONMENTAL SENSOR STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE

WETTABLE LEAD ENDS ON A FLAT-PACK NO-LEAD MICROELECTRONIC PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE

METHODS FOR FABRICATING SENSOR DEVICE PACKAGE USING A SEALING STRUC...

SENSOR DEVICE WITH SEALING STRUCTURE

SEMICONDUCTOR DEVICE WITH A CONTROLLED CAVITY AND METHOD OF FORMATION