Dyi-Chung HU

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor substrate and manufacturing method thereof
- Patent number 12,148,688
- Issue date Nov 19, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate structure, semiconductor structure and manu...
- Patent number 12,148,726
- Issue date Nov 19, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass core substrate and manufacturing method thereof
- Patent number 12,100,632
- Issue date Sep 24, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate structure and manufacturing method thereof
- Patent number 12,014,934
- Issue date Jun 18, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of integrated substrate
- Patent number 12,009,329
- Issue date Jun 11, 2024
- Dyi-Chung Hu
- G01 - MEASURING TESTING
Information Patent Grant
Integrated substrate structure, redistribution structure, and manuf...
- Patent number 11,984,403
- Issue date May 14, 2024
- Dyi-Chung Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor substrate structure and manufacturing method thereof
- Patent number 11,948,899
- Issue date Apr 2, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter-wave antenna module package structure and manufacturing...
- Patent number 11,876,291
- Issue date Jan 16, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated substrate structure, electronic assembly, and manufactur...
- Patent number 11,862,545
- Issue date Jan 2, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and method of fabricating the same
- Patent number 11,791,256
- Issue date Oct 17, 2023
- Industrial Technology Research Institute
- Yu-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,567,122
- Issue date Jan 31, 2023
- Dyi-Chung Hu
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method of carrier for semiconductor chip mounting the...
- Patent number 11,404,335
- Issue date Aug 2, 2022
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and package structure
- Patent number 11,309,252
- Issue date Apr 19, 2022
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated substrate and manufacturing method thereof
- Patent number 11,125,781
- Issue date Sep 21, 2021
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier for chip packaging and manufacturing method thereof
- Patent number 11,049,779
- Issue date Jun 29, 2021
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure with high-density wiring and manufacturing meth...
- Patent number 11,024,573
- Issue date Jun 1, 2021
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Space transformer and manufacturing method thereof
- Patent number 11,018,082
- Issue date May 25, 2021
- Dyi-Chung Hu
- G01 - MEASURING TESTING
Information Patent Grant
Wafer reconfiguration during a coating process or an electric plati...
- Patent number 10,964,580
- Issue date Mar 30, 2021
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and method of fabricating the same
- Patent number 10,867,907
- Issue date Dec 15, 2020
- Industrial Technology Research Institute
- Yu-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and package structure
- Patent number 10,818,584
- Issue date Oct 27, 2020
- Dyi-Chung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate and package structure
- Patent number 10,643,936
- Issue date May 5, 2020
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure and electronic device having coarse redistribut...
- Patent number 10,535,622
- Issue date Jan 14, 2020
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 10,395,946
- Issue date Aug 27, 2019
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate
- Patent number 10,373,918
- Issue date Aug 6, 2019
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite carrier for warpage management
- Patent number 10,304,786
- Issue date May 28, 2019
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of integrated circuit package
- Patent number 10,304,794
- Issue date May 28, 2019
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate with embedded noise shielding walls
- Patent number 10,290,586
- Issue date May 14, 2019
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure having embedded bonding film
- Patent number 10,283,455
- Issue date May 7, 2019
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate with embedded circuit
- Patent number 10,236,245
- Issue date Mar 19, 2019
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure and manufacturing method thereof
- Patent number 10,224,300
- Issue date Mar 5, 2019
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240413072
- Publication date Dec 12, 2024
- Dyi-Chung HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240274482
- Publication date Aug 15, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240274520
- Publication date Aug 15, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING INTEGRATED SUBSTRATE STRUCTURE
- Publication number 20240222277
- Publication date Jul 4, 2024
- Dyi-Chung HU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR SUBSTRATE STRUCTURE, SEMICONDUCTOR STRUCTURE AND MANU...
- Publication number 20240203921
- Publication date Jun 20, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF MILLIMETER-WAVE ANTENNA MODULE PACKAGE STRU...
- Publication number 20240088552
- Publication date Mar 14, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF INTEGRATED SUBSTRATE STRUCTURE
- Publication number 20240079304
- Publication date Mar 7, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230136778
- Publication date May 4, 2023
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER-WAVE ANTENNA MODULE PACKAGE STRUCTURE AND MANUFACTURING...
- Publication number 20230140354
- Publication date May 4, 2023
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230136788
- Publication date May 4, 2023
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230117207
- Publication date Apr 20, 2023
- Dyi-Chung HU
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD THEREOF AND SEMICO...
- Publication number 20220328391
- Publication date Oct 13, 2022
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT CARRIER WITH CHIP MOUNTED THEREON
- Publication number 20220328370
- Publication date Oct 13, 2022
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND MANUFACTURING METHOD THEREOF
- Publication number 20220254708
- Publication date Aug 11, 2022
- Dyi-Chung HU
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE SUBSTRATE AND PACKAGE STRUCTURE
- Publication number 20220181244
- Publication date Jun 9, 2022
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SUBSTRATE STRUCTURE, ELECTRONIC ASSEMBLY, AND MANUFACTUR...
- Publication number 20220037245
- Publication date Feb 3, 2022
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF INTEGRATED SUBSTRATE
- Publication number 20210382088
- Publication date Dec 9, 2021
- Dyi-Chung HU
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210302495
- Publication date Sep 30, 2021
- Dyi-Chung HU
- G01 - MEASURING TESTING
Information Patent Application
MANUFACTURING METHOD OF CARRIER FOR SEMICONDUCTOR CHIP MOUNTING THE...
- Publication number 20210272864
- Publication date Sep 2, 2021
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SUBSTRATE STRUCTURE, REDISTRIBUTION STRUCTURE, AND MANUF...
- Publication number 20210151382
- Publication date May 20, 2021
- Dyi-Chung HU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME
- Publication number 20210066189
- Publication date Mar 4, 2021
- Industrial Technology Research Institute
- Yu-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210020577
- Publication date Jan 21, 2021
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND PACKAGE STRUCTURE
- Publication number 20200411442
- Publication date Dec 31, 2020
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE WITH HIGH-DENSITY WIRING AND MANUFACTURING METH...
- Publication number 20200227346
- Publication date Jul 16, 2020
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER FOR CHIP PACKAGING AND MANUFACTURING METHOD THEREOF
- Publication number 20200118898
- Publication date Apr 16, 2020
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND MANUFACTURING METHOD THEREOF
- Publication number 20200035591
- Publication date Jan 30, 2020
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACE TRANSFORMER AND MANUFACTURING METHOD THEREOF
- Publication number 20200033381
- Publication date Jan 30, 2020
- Dyi-Chung HU
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE STRUCTURE AND ELECTRONIC DEVICE
- Publication number 20190181112
- Publication date Jun 13, 2019
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND PACKAGE STRUCTURE
- Publication number 20190148273
- Publication date May 16, 2019
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190074195
- Publication date Mar 7, 2019
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS

Dyi-Chung HU

Person

Patents Grantslast 30 patents

Semiconductor substrate and manufacturing method thereof

Semiconductor substrate structure, semiconductor structure and manu...

Glass core substrate and manufacturing method thereof

Semiconductor substrate structure and manufacturing method thereof

Manufacturing method of integrated substrate

Integrated substrate structure, redistribution structure, and manuf...

Semiconductor substrate structure and manufacturing method thereof

Millimeter-wave antenna module package structure and manufacturing...

Integrated substrate structure, electronic assembly, and manufactur...

Package substrate and method of fabricating the same

Semiconductor device and manufacturing method thereof

Manufacturing method of carrier for semiconductor chip mounting the...

Package substrate and package structure

Integrated substrate and manufacturing method thereof

Carrier for chip packaging and manufacturing method thereof

Substrate structure with high-density wiring and manufacturing meth...

Space transformer and manufacturing method thereof

Wafer reconfiguration during a coating process or an electric plati...

Package substrate and method of fabricating the same

Package substrate and package structure

Package substrate and package structure

Substrate structure and electronic device having coarse redistribut...

Electronic package and manufacturing method thereof

Package substrate

Composite carrier for warpage management

Manufacturing method of integrated circuit package

Package substrate with embedded noise shielding walls

Manufacturing method of package structure having embedded bonding film

Package substrate with embedded circuit

Pad structure and manufacturing method thereof

Patents Applicationslast 30 patents

SUBSTRATE AND MANUFACTURING METHOD THEREOF

GLASS CORE SUBSTRATE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING INTEGRATED SUBSTRATE STRUCTURE

SEMICONDUCTOR SUBSTRATE STRUCTURE, SEMICONDUCTOR STRUCTURE AND MANU...

MANUFACTURING METHOD OF MILLIMETER-WAVE ANTENNA MODULE PACKAGE STRU...

MANUFACTURING METHOD OF INTEGRATED SUBSTRATE STRUCTURE

SEMICONDUCTOR SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

MILLIMETER-WAVE ANTENNA MODULE PACKAGE STRUCTURE AND MANUFACTURING...

SEMICONDUCTOR SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD THEREOF AND SEMICO...

MANUFACTURING METHOD OF CIRCUIT CARRIER WITH CHIP MOUNTED THEREON

INTERPOSER AND MANUFACTURING METHOD THEREOF

PACKAGE SUBSTRATE AND PACKAGE STRUCTURE

INTEGRATED SUBSTRATE STRUCTURE, ELECTRONIC ASSEMBLY, AND MANUFACTUR...

MANUFACTURING METHOD OF INTEGRATED SUBSTRATE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF CARRIER FOR SEMICONDUCTOR CHIP MOUNTING THE...

INTEGRATED SUBSTRATE STRUCTURE, REDISTRIBUTION STRUCTURE, AND MANUF...

PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE SUBSTRATE AND PACKAGE STRUCTURE

SUBSTRATE STRUCTURE WITH HIGH-DENSITY WIRING AND MANUFACTURING METH...

CARRIER FOR CHIP PACKAGING AND MANUFACTURING METHOD THEREOF

INTERPOSER AND MANUFACTURING METHOD THEREOF

SPACE TRANSFORMER AND MANUFACTURING METHOD THEREOF

SUBSTRATE STRUCTURE AND ELECTRONIC DEVICE

PACKAGE SUBSTRATE AND PACKAGE STRUCTURE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF