Dylan Murdock

Person

Allen, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structural arrangements for spatial power-combining devices
- Patent number 11,955,687
- Issue date Apr 9, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power laminate RF package
- Patent number 11,791,251
- Issue date Oct 17, 2023
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal structures for heat transfer devices and spatial power-comb...
- Patent number 11,665,867
- Issue date May 30, 2023
- Qorvo US, Inc.
- Dylan Murdock
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Power-combining devices with increased output power
- Patent number 11,621,469
- Issue date Apr 4, 2023
- Qorvo US, Inc.
- John Kitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal structures for heat transfer devices and spatial power-comb...
- Patent number 11,564,337
- Issue date Jan 24, 2023
- Qorvo US, Inc.
- Dylan Murdock
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Heat exchanger assemblies for electronic devices
- Patent number 11,255,608
- Issue date Feb 22, 2022
- Qorvo US, Inc.
- Gregory Valenti
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat exchanger assemblies for electronic devices and related methods
- Patent number 11,162,734
- Issue date Nov 2, 2021
- Qorvo US, Inc.
- Gregory Valenti
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat exchanger assemblies for electronic devices
- Patent number 10,976,108
- Issue date Apr 13, 2021
- Qorvo US, Inc.
- Gregory Valenti
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Structures for spatial power-combining devices
- Patent number 10,855,240
- Issue date Dec 1, 2020
- Qorvo US, Inc.
- Christo Bojkov
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Heat transfer device incorporating a helical flow element within a...
- Patent number 10,539,371
- Issue date Jan 21, 2020
- Qorvo US, Inc.
- Eric Jackson
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Environmentally robust plating configuration for metal-diamond comp...
- Patent number 10,418,257
- Issue date Sep 17, 2019
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular semiconductor package
- Patent number 10,015,882
- Issue date Jul 3, 2018
- Qorvo US, Inc.
- Dylan Murdock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with integrated heat spreader
- Patent number 9,911,678
- Issue date Mar 6, 2018
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURAL ARRANGEMENTS FOR SPATIAL POWER-COMBINING DEVICES
- Publication number 20240195041
- Publication date Jun 13, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT PACKAGE WITH IMPROVED THERMAL MANAGEMENT
- Publication number 20240055319
- Publication date Feb 15, 2024
- Qorvo US, Inc.
- Matthew Irvine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURAL ARRANGEMENTS FOR SPATIAL POWER-COMBINING DEVICES
- Publication number 20230223673
- Publication date Jul 13, 2023
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER LAMINATE RF PACKAGE
- Publication number 20230036197
- Publication date Feb 2, 2023
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL STRUCTURES FOR HEAT TRANSFER DEVICES AND SPATIAL POWER-COMB...
- Publication number 20220279676
- Publication date Sep 1, 2022
- Qorvo US, Inc.
- Dylan Murdock
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
POWER-COMBINING DEVICES WITH INCREASED OUTPUT POWER
- Publication number 20220247061
- Publication date Aug 4, 2022
- Qorvo US, Inc.
- John Kitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC PACKAGE FOR HIGH CTE MISMATCH
- Publication number 20220044979
- Publication date Feb 10, 2022
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC PACKAGE FOR HIGH CTE MISMATCH
- Publication number 20220044981
- Publication date Feb 10, 2022
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL STRUCTURES FOR HEAT TRANSFER DEVICES AND SPATIAL POWER-COMB...
- Publication number 20210298207
- Publication date Sep 23, 2021
- Qorvo US, Inc.
- Dylan Murdock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURES FOR SPATIAL POWER-COMBINING DEVICES
- Publication number 20200162046
- Publication date May 21, 2020
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT EXCHANGER ASSEMBLIES FOR ELECTRONIC DEVICES AND RELATED METHODS
- Publication number 20200041210
- Publication date Feb 6, 2020
- Qorvo US, Inc.
- Gregory Valenti
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT EXCHANGER ASSEMBLIES FOR ELECTRONIC DEVICES
- Publication number 20200041209
- Publication date Feb 6, 2020
- Qorvo US, Inc.
- Gregory Valenti
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT TRANSFER DEVICE INCORPORATING A HELICAL FLOW ELEMENT WITHIN A...
- Publication number 20180202722
- Publication date Jul 19, 2018
- Qorvo US, Inc.
- Eric Jackson
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SUBSTRATE WITH INTEGRATED HEAT SPREADER
- Publication number 20170358515
- Publication date Dec 14, 2017
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SPREADER HAVING GRADUATED THERMAL EXPANSION PARAMETERS
- Publication number 20130308274
- Publication date Nov 21, 2013
- TriQuint Semiconductor, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS

Dylan Murdock

Person

Patents Grantslast 30 patents

Hermetic package for high CTE mismatch

Structural arrangements for spatial power-combining devices

High power laminate RF package

Thermal structures for heat transfer devices and spatial power-comb...

Power-combining devices with increased output power

Thermal structures for heat transfer devices and spatial power-comb...

Heat exchanger assemblies for electronic devices

Heat exchanger assemblies for electronic devices and related methods

Heat exchanger assemblies for electronic devices

Structures for spatial power-combining devices

Heat transfer device incorporating a helical flow element within a...

Environmentally robust plating configuration for metal-diamond comp...

Modular semiconductor package

Substrate with integrated heat spreader

Patents Applicationslast 30 patents

STRUCTURAL ARRANGEMENTS FOR SPATIAL POWER-COMBINING DEVICES

CIRCUIT PACKAGE WITH IMPROVED THERMAL MANAGEMENT

STRUCTURAL ARRANGEMENTS FOR SPATIAL POWER-COMBINING DEVICES

HIGH POWER LAMINATE RF PACKAGE

THERMAL STRUCTURES FOR HEAT TRANSFER DEVICES AND SPATIAL POWER-COMB...

POWER-COMBINING DEVICES WITH INCREASED OUTPUT POWER

HERMETIC PACKAGE FOR HIGH CTE MISMATCH

HERMETIC PACKAGE FOR HIGH CTE MISMATCH

THERMAL STRUCTURES FOR HEAT TRANSFER DEVICES AND SPATIAL POWER-COMB...

STRUCTURES FOR SPATIAL POWER-COMBINING DEVICES

HEAT EXCHANGER ASSEMBLIES FOR ELECTRONIC DEVICES AND RELATED METHODS

HEAT EXCHANGER ASSEMBLIES FOR ELECTRONIC DEVICES

HEAT TRANSFER DEVICE INCORPORATING A HELICAL FLOW ELEMENT WITHIN A...

SUBSTRATE WITH INTEGRATED HEAT SPREADER

THERMAL SPREADER HAVING GRADUATED THERMAL EXPANSION PARAMETERS