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Dylan S. Shah
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Pittsburgh, PA, US
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last 30 patents
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Patent Grant
Thermal interface material, an integrated circuit formed therewith,...
Patent number
12,027,442
Issue date
Jul 2, 2024
ARIECA INC.
Jeffrey Gelorme
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
METHODS AND SYSTEMS FOR GENERATING A BOND LINE PARAMETER OF A CIRCU...
Publication number
20250037294
Publication date
Jan 30, 2025
Arieca Inc.
Loren Russell
G06 - COMPUTING CALCULATING COUNTING
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Patent Application
METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...
Publication number
20240203754
Publication date
Jun 20, 2024
Arieca Inc.
Navid Kazem
H01 - BASIC ELECTRIC ELEMENTS